Identifying and accessing individual memory devices in a memory channel

ABSTRACT

In one embodiment of the invention, a memory integrated circuit is provided including a memory array, a register, and control logic coupled to the register. The memory array in the memory integrated circuit stores data. The register includes one or more bit storage circuits to store one or more identity bits of an identity value. The control logic provides independent sub-channel memory access into the memory integrated circuit in response to the one or more identity bits stored in the register.

CLAIM OF PRIORITY

The present application is a Continuation of, and claims priority to andincorporates by reference in its entirety, the corresponding U.S. patentapplication Ser. No. 12/974,862, entitled “IDENTIFYING AND ACCESSINGINDIVIDUAL MEMORY DEVICES IN A MEMORY CHANNEL,” filed on Dec. 21, 2010,and issued as U.S. Pat. No. 8,064,237 on Nov. 22, 2011, which is aContinuation of, and claims priority to and incorporates by reference inits entirety, U.S. patent application Ser. No. 11/174,236, entitled“IDENTIFYING AND ACCESSING INDIVIDUAL MEMORY DEVICES IN A MEMORYCHANNEL,” filed on Jul. 5, 2005 and issued as U.S. Pat. No. 7,872,892 onJan. 18, 2011.

FIELD

Embodiments of the invention relate generally to memory and specificallyto assigning identification numbers to memory integrated circuits ofmemory modules to support independent sub-channel memory accesses intomemory channels.

BACKGROUND INFORMATION

In a memory architecture with a uniform or unified memory access,sometimes referred to as a unified memory architecture (UMA), aprocessor and a graphic controller share system memory to lower costs.Typically, a UMA memory architecture may be optimized to handle memoryrequests (read/write accesses) from the processor into the systemmemory. The typical UMA memory architecture compromises the memoryrequests made by the graphics controller. Today, graphics performancehas become more important to support three dimensions (3D) as well ashigher resolution.

In the typical UMA memory architecture, cache memory uses a fixed sixtyfour (64) byte cache-line to support memory requests made by both theprocessor and memory requests made by the graphics controller. A typicalmemory controller in a UMA memory architecture has one or two memorychannels. Each memory channel shares all address lines in an address buswith each memory module in order to perform read or write accesses. Thedata bus in the typical memory channel is typically sixty-four (64) bitswide so that eight (8) bytes of contiguous data for a given address areaccessed from memory at the same time. The bits of the data bus may berouted to memory modules in different ways depending upon the type ofmemory and memory size utilized.

While a processor typically uses all 64 bits of contiguous data accessedfrom the memory, a graphics controller typically may not. Much of thecontiguous data may be discarded when a graphics controller makes amemory request in a UMA memory architecture. Thus, the bandwidth of thememory channel may be inefficiently used by memory requests issued bythe graphics controller in the typical UMA memory architecture.

BRIEF DESCRIPTION OF THE DRAWINGS

The features of the embodiments of the invention will become apparentfrom the following detailed description in which:

FIG. 1A illustrates a block diagram of a typical computer system inwhich embodiments of the invention may be utilized.

FIG. 1B illustrates a block diagram of a client-server system in whichembodiments of the invention may be utilized.

FIG. 2 illustrates a block diagram of a first cent a processing unit inwhich embodiments of the invention may be utilized.

FIG. 3A illustrates a high level block diagram of a memory control blockcoupled to a pair of memory channels each including four memorysub-channels.

FIG. 3B illustrates a detailed block diagram of memory controllers in amemory control block coupled to cache memory and a pair of memorychannels including a plurality of S sub-channels.

FIG. 4A is a diagram illustrating the mapping of pixels on a videodisplay to memory accesses over a memory channel without sub-channelsusing a linear memory access.

FIG. 4B is a diagram illustrating the mapping of pixels on a videodisplay to memory accesses over a memory channel with two sub-channelssupporting a micro-tiling memory access.

FIG. 4C is a diagram illustrating the mapping of pixels on a videodisplay to memory accesses over a memory channel with four sub-channelssupporting a micro-tiling memory access.

FIG. 5A is a diagram illustrating a linear sixty-four byte memory accessover a sixty four bit wide memory channel.

FIG. 5B is a diagram illustrating independent sub-channel memory accessof a pair of thirty-two byte memory accesses over a pair of thirty-twobit wide memory sub-channels.

FIG. 5C is a diagram illustrating independent sub-channel memory accessof four sixteen byte memory accesses over four of sixteen bit widememory sub-channels.

FIG. 6 illustrates an address signal line bit map for a memory channel.

FIG. 7 illustrates a block diagram of a multi-chip memory module tocouple to a connector mounted on a host printed circuit board.

FIG. 8 illustrates a block diagram of a memory integrated circuit tosupport micro-tile memory accesses over memory sub-channels.

FIG. 9 illustrates a schematic diagram of address overload logic coupledto the mode register for a sixteen bit wide memory sub-channel and asixteen byte memory access.

FIG. 10A illustrates a block diagram of a multi-chip memory module andjumper wires configured to assign and identify memory integratedcircuits with a pair of subchannels in a memory channel.

FIG. 10B illustrates a block diagram of a multi-chip memory module andjumper wires configured to assign and identify memory integratedcircuits with four subchannels in a memory channel.

FIG. 10C illustrates a block diagram of a multi-chip memory module andone or more dipswitches to assign and identify memory integratedcircuits with a plurality of subchannels in a memory channel.

FIG. 11A illustrates a block diagram of control circuitry including abuffer to receive the identity bits from the identity pins for thehard-wire settings of FIGS. 10A-10C.

FIG. 11B illustrates a block diagram of control circuitry including aregister to receive the identity bits from the identity pins for thehard-wire settings of FIGS. 10A-10C.

FIG. 11C illustrates a block diagram of control circuitry including aregister to capture identity information after a specific number ofclock cycles out of reset.

FIG. 11D illustrates a block diagram of control circuitry including aregister to capture identity information coincident with a strobe of acontrol signal after reset.

FIG. 12A illustrates one exemplary alignment of data bits D0 and D1 indata bytes into a first plurality of memory integrated circuits in amemory module.

FIG. 12B illustrates a second exemplary alignment of data bits D0 and D1in data bytes into a second plurality of memory integrated circuits in amemory module.

FIG. 13A is a timing diagram for the control circuitry of FIG. 11C.

FIG. 13B is a timing diagram for the control circuitry of FIG. 11D,

FIG. 14 is a block diagram of a memory controller coupled to a memorymodule to illustrate an exemplary method of loading identity values intoa register in response to a data qualifier on a data bus.

Like reference numbers and designations in the drawings indicate likeelements providing similar functionality.

DETAILED DESCRIPTION

In the following detailed description of embodiments of the invention,numerous specific details are set forth in order to provide a thoroughunderstanding of the invention. However, it will be obvious to oneskilled in the art that the embodiments of the invention may bepracticed without these specific details. In other instances well knownmethods, procedures, components, and circuits have not been described indetail so as not to unnecessarily obscure aspects of the embodiments ofthe invention.

The memory efficiency of an integrated graphics computer system istypically limited due to the size of a cache-line. Quite often the idealmemory access size for graphics is four to sixteen bytes of data sincegraphics processors operate on one or a few pixels or texels at a time.However, LIMA memory architectures are optimized for a 64 bytecache-line to optimize processor memory efficiency. With a 64 bytecache-line, memory requests by a graphics controller result, on average,in a significant amount of data fetched from memory and never used bythe graphics controller. The un-used data may be referred to asover-fetch.

With micro-tiling, the over-fetch of memory requests from a graphicscontroller can be reduced while preserving cache-line requirements in aUMA memory architecture with an integrated graphics controller.Generally, micro-tiling uses a new memory architecture and a new memorycontroller architecture. To support a micro-tiling memory architecture,the new memory subsystem provides independent sub-channel memoryaccesses within a memory channel. These independent sub-channel memoryaccesses into a memory may be referred to as micro-tile or micro-tiledmemory accesses and generally referred to as micro-tiling.

While the new memory controller and memory architectures are described,the focus of this application is on loading identity values into memoryintegrated circuits on memory modules to support micro-tiling.

Memory integrated circuits in a memory array may be assigned a valuethat is unique among the other memory integrated circuits in the samememory array. The embodiments of the invention include an identifier andprovide a mechanism to set the value of the identifier. The identifiermay be referred to as an identity value having identity bits.

One application of the identity value is for independent sub-channelmemory access, also referred to as micro-tile memory access. Theembodiments of the invention, allow sub-channel select bits to be loadedinto a register within each memory integrated circuit of each memorymodule in each memory channel.

In one embodiment of the invention, a method is disclosed includingproviding a memory module with a plurality of memory integratedcircuits, each of the plurality of memory integrated circuits having atleast two pins to couple information into the memory integrated circuit;setting values of at least two identity bits respectively onto the atleast two pins of one memory integrated circuit; receiving the at leasttwo identity bits into the one memory integrated circuit as an identityvalue; and qualifying a function of the at least one memory integratedcircuit with the at least two identity bits.

In another embodiment of the invention, a memory integrated circuit isprovided including a memory array, a register, and control logic coupledto the register. The memory array in the memory integrated circuitstores data. The register includes one or more bit storage circuits tostore one or more identity bits of an identity value. The control logicprovides independent sub-channel memory access into the memoryintegrated circuit in response to the one or more identity bits storedin the register.

In yet another embodiment of the invention, a memory module is disclosedincluding a printed circuit board with an electrical connector to coupleto a host printed circuit board, and a plurality of memory integratedcircuits mounted to the printed circuit board and coupled to the edgeconnection. The electrical connector includes a power connection and aground connection. Each of the memory integrated circuits mounted to themodule include a memory array to store data; a register including one ormore bit storage circuits having a data input coupled to bits of a databus, and control logic coupled to the register. The register stores oneor more sub-channel select bits on the bits of the data bus in responseto a load signal. The control logic provides independent sub-channelmemory access into the memory integrated circuit in response to the oneor more sub-channel select bits stored in the register.

Briefly stated, micro-tiling enables a memory request to be composed ofsmaller requests for discontiguous sections or chunks of memory. Themicro-tiling memory architecture allows read and write memory fetches tovary in size and structure based on the needs of the requestor. In orderfor the smaller chunks to be correctly identified, additional addressinformation is provided into the system memory by the micro-tiled memorycontroller. For example, in one embodiment of the invention a sixty-fourbit wide memory channel (the physical bit width) may be divided up intofour sixteen bit wide sub-channels. In this implementation, a sixty-fourbyte memory access (the logical byte width of a memory channel) iscomposed of four discontiguous sixteen byte chunks (assuming that amemory transaction is a burst of 8 transfers). Each sub-channel usessome unique address information. FIG. 3A is an exemplary implementationof four sixteen bit sub-channels, each having some unique addressinformation. Other implementations of a micro-tile memory architecturecan vary the size of each sub-channel and the number of independentaddress lines provided into each sub-channel.

There are several methods available to supply additional independentaddress information to each sub-channel of the memory array includingsupplying additional address lines by routing new dedicated lines fromthe memory controller to the memory integrated devices or re-targetingunused error correction code (ECC) signal lines routed in a memorymodule to be additional address lines. The independent additionaladdress information may also be supplied by overloading pre-existingaddress signal lines during typical periods of non-use, such as during amemory cycle when the column addresses are written into memoryintegrated circuits. In this case, micro-tiling support can beimplemented in memory modules and still provide backward compatibilityto pre-existing memory module implementations. These methods may be usedseparately, or in combination in embodiments of the invention to providethe additional address information over a desired number of addresslines, including any additional address lines.

In a standard memory channel, such as a memory channel based on doubledata rate (DDR) DRAM technology, the logical width of the memory channelcan be considered to be M bytes wide. There are eight bits in a byte ofdata. The logical width of the memory channel is somewhat related to theburst length of data transfers over a memory module. That is, M bytes ofdata can be consecutively accessed by data transfers that form a burst,by using consecutive addresses incremented from a base address.Typically, the base address of the block of bytes to be accessed (reador written) is an integer multiple of the logical width of the channel.The physical width of the memory channel is the bit width of the databus between the memory controller and the memory modules. The typicalminimum burst length may be eight memory cycles with a starting byteorder that may be set by the least significant bits of the addresslines. With a typical physical width of sixty-four bits, eight memorycycles accesses sixty-four bytes of data in a memory channel. Thus thetypical logical width of the memory channel is sixty-four bytes of data.

As discussed previously, the logical width of the memory channel is thenumber of bytes that can be consecutively transferred with a baseaddress and the physical width of the memory channel is the bit width ofthe data bus (“W_(DB)”) between the memory controller and the memorymodules. A micro-tiled memory system equally divides the logical widthand the physical width of the memory channel into sub-channels havingsmaller logical byte widths and smaller physical bit widths.

The micro-tiling of memory breaks the physical width of the memorychannel (W_(DB) bits) and the logical width of the memory channel (Mbytes) into S sub-channels (W_(SC)). Each sub-channel has a physicalwidth of W_(SC)=W_(DB)/S bits and a logical width of N=M/S bytes. Thus,N bytes of data may be transferred over W_(SC) bits of data lines ineach sub-channel for each burst of data transfers. A memory channel mayhave a total number of memory locations T_(ML) to access in memory. Eachsub-channel accesses a subset of the total memory locations (T_(SML)) ofa memory channel where T_(SML)=T_(ML)/S.

In micro-tiling memory, each sub-channel can access a smallergranularity of data over the memory channel independently from eachother. To make them completely independent, separate address signallines may be routed from the memory controller to each sub-channel. Toavoid routing too many separate address signal lines, some addresssignal lines may be shared across the sub-channels so that memorylocations can be independently selected from a set of common addresses.Thus, the address that is presented to each sub-channel has a number ofindependent address bits (“I”) whose value can be different fromcorresponding bits in the addresses presented to the other sub-channels.Thus, while the data transferred on each sub-channel represents acontiguous block of data, the blocks of data on each sub-channel are notnecessarily formed from a contiguous address range. This is because theindependent address bits I may be from different bit positions, as isdiscussed further below.

The embodiments of the invention may be used in different systems suchas those illustrated in FIGS. 1A-1B. Referring now to FIG. 1A, a blockdiagram of a typical computer system 100 in which embodiments of theinvention may be utilized is illustrated. The computer system 100Aincludes a processing unit 101; input/output devices (I/O) 102 such askeyboard, modem, printer, external storage devices and the like; andmonitoring devices (M) 103, such as a CRT or graphics display. Themonitoring devices (M) 103 may provide computer information in a humanintelligible format such as visual or audio formats. The system 100 maybe a number of different electronic systems other than a computersystem.

Referring now to FIG. 1B, a client server system 100B in whichembodiments of the invention may be utilized is illustrated. The clientserver system 100B includes one or more clients 110A-110M coupled to anetwork 112 and a server 114 coupled to the network 112. The clients110A-110M communicate with the server 114 through the network 112 inorder to transmit or receive information and gain access to any databaseand/or application software that may be needed on the server. Theclients 110A-110M and the server 114 may be instances of the typicalcomputer system 100A. The server 114 has a processing unit with memoryand may further include one or more disk drive storage devices. Theserver 114 may be used in a storage area network (SAN) as a networkattached storage (NAS) device, for example, and have an array of disks.The data access to the server 114 may be shared over the network 112with the multiple clients 110A-110C.

Referring now to FIG. 2, a detailed block diagram of a processing unit101 in which embodiments of the invention may be utilized isillustrated. The processing unit 101 may include a processor circuit201, a memory control block 202, external cache memory 203E, one or morememory channels 204A-204N, a graphics controller 206, and aninput/output controller 207 coupled together as shown. A combination oftwo or more elements of the processor circuit 201, the memory controlblock 202, the cache memory 203E, the graphics controller 206, and theinput/output controller 207 of the processing unit 101 may be integratedtogether into a single integrated circuit. For example, the memorycontrol block 202, the graphics controller 206, and the input/outputcontroller 207 may be integrated together as an integrated circuit 210.As another example, the processor circuit 201, the memory control block202, the cache memory 203E, the graphics controller 206, and theinput/output controller 207 may be integrated together as an integratedcircuit 210. As another example, the memory control block 207 with itsmemory controller may be integrated into the processor circuit 201.While the external cache memory 203E coupled between the processorcircuit 201 and the memory control block 202 is illustrated as beingpart of the integrated circuit 210, it may be a separate circuit.Oftentimes, the cache memory 203E remains external to the integratedcircuit 210 as it is more efficient to manufacture large memorycapacities separately.

The processor circuit 201 may include one or more execution units ormore than one processor (also referred to as core processors), such asprocessors A-N 201A-201N, as a multiprocessor integrated circuit. Eachprocessor of the processor circuit 201 may have one or more levels of anon-chip or internal cache memory 2031 or share the same internal cachememory. Other levels of cache memory may be external to the processor201 and interface to the memory controller, such as external cachememory 203E. The processor circuit 201 may also have an on-chip orinternal random access memory (RAM) and an on-chip or internal read onlymemory (ROM) as a microcomputer may have. The processor 201, its one ormore execution units, and the one or more levels of cache memory mayread or write data (including instructions) through the memory controlblock 202 with the one or more memory channels 204A-204N.

The memory control block 202, coupled to and between the one or morememory channels 204A-204N and the processor 201 as well as the graphicscontroller 206, may optionally have its own internal cache memory 203Mor it may be external as another level of cache memory. The memorycontrol block 202 includes one or more micro-tile memory controllersMCA-MCN 208A-208N for each of the respective one or more memory channels204A-204N.

Each of the one or more memory channels 204A-204N includes one or morememory modules MM1-MMn. Each memory module includes one or more memoryintegrated circuits or devices. The one or more memory integratedcircuits or devices may be various types of memory integrated circuitsincluding dynamic random access memory (DRAM) circuits, static randomaccess memory (SRAM) circuits, or nonvolatile random access memory(NVRAM) circuits. However, in the preferred embodiment of the invention,the one or more memory integrated circuits are dynamic random accessmemory (DRAM) circuits.

Each of the one or more memory channels 204A-204N includes two or morememory sub-channels. In FIG. 2, four memory sub-channels 205A-205D areincluded in each memory channel 204A-204N. While four memorysub-channels are illustrated in each memory channel it is understoodthat other divisions of a memory channel may be had including even orodd numbers of sub-channels, such as two memory sub-channels. Thedivisions of a memory channel may particularly change as the logicalwidth or burst lengths of a memory channel increases.

The one or more memory modules MM1-MMN in each memory channel 204A-204Nmay be configured to support micro-tiling. An algorithm may be used bythe memory control block to determine whether or not the one or morememory modules support micro-tiling. The one or more memory circuits ordevices included on the one or more memory modules may be configured tosupport micro-tiling. The one or more memory circuits can be micro-tiledenabled (MTE) and assigned to support a specific memory sub-channel. Theone or more memory circuits may include additional pins or haveadditional bits in a mode register to be micro-tiled enabled andassigned to a specific memory sub-channel. In the case of additionalpins being provided by the memory circuits, external jumper pins, jumperwires, or micro-switches (for example, DIP switches) may be used toconfigure micro-tiling support. In the case of the mode register beingprovided in the memory circuits, the independent portion of the data businto each sub-channel may be used to load the mode register with anappropriate loading strobe.

The I/O controller 207 may be coupled to the memory control block 202 towrite data into the one or more memory channels 204A-204N so it isaccessible by the processor 201. The processing unit 101 may furtherinclude a wireless network interface circuit (WNIC) 213, a wired networkinterface circuit or card (NIC) 214, a universal serial bus (USB) and/orfirewire (FW) serial interface 215, and/or a disk drive 216 coupled tothe I/O controller 207. The wireless network interface circuit (WNIC)213 provides a radio connection to a base radio unit such as through awireless local area networking, wifi (IEEE 802.11), Bluetooth, or otherradio connection. The wireless networking interconnection (WNIC) 213includes an antenna to couple by radio waves to a base radio unit orother mobile radio unit. The NIC 214 provides an Ethernet wired localarea network connection. The USB/FW serial interface 215 allows forexpansion of the system to include other I/O peripheral devices. Thedisk drive 216 is well known and provides rewriteable storage for theprocessor 201. The disk storage device 216 may be one or more of afloppy disk, zip disk, DVD disk, hard disk, rewritable optical disk,flash memory or other non-volatile storage device.

The graphics controller 206 is coupled to the memory control block 202to read and write data into the one or more memory channels 204A-204N.The processor 201 may write data into the one or more memory channels204A-204N so that it is accessible by the graphics controller 206 anddisplayable on a graphics display or video device. A graphics display217 may be coupled to the graphics controller 206. A video interface 218may couple to the graphics controller 206. The video interface 218 maybe an analog and/or digital video interface.

In the processing unit 101, the processor 201, the I/O controller 207,and the graphics controller 206 may access data in the one or morememory channels 204A-204N through memory controllers in the memorycontrol block 202. The memory controllers in the memory control blockinterface to a respective memory channel 204A-240N to read and writedata between the system memory and the processor 201, the I/O controller207, and the graphics controller 206. In interfacing the micro-tiledmemory controllers 208A-208N to the memory channels 204A-204N,respectively, there may be address signal lines 220 of an address bus,data signal lines 222 of a data bus, and control and clocking signallines 224 as part of the memory interface. The input devices coupled tothe I/O controller 207, such as the disk storage device 216, may alsoread and write information into the system memory.

Generally, the data signal lines 222 of the data bus are divided outinto the S sub-channels. In FIG. 2, where S is four, the data signallines 222 of the data bus are divided out into four sub-channels asillustrated by the sub-channel data lines 222A, 222B, 222C, and 222D andcoupled into the respective sub-channels 205A, 205B, 205C, and 205D. Forexample, a sixty four-bit bus is divided into four sets of sixteen bitdata lines. Some of the address signal lines 220 may be shared into thesub-channels while other address signal lines are independent from onesub-channel to the next, in one embodiment of the invention. In anotherembodiment of the invention, the address signal lines 220 may be hillyindependent into each sub-channel. The address signal lines are furtherdescribed below.

Referring now to FIG. 3A, a block diagram of a two memory channels isillustrated. FIG. 3A illustrates a combined graphics and memorycontroller 300 (HOST (GFX & MEM CNTRL)), also referred to as a host 300,coupled to a memory channel 0 304A and a memory channel 1 304B. Memorychannel 0 304A and memory channel 1 304B are each divided into foursub-channels 305A, 305B, 305C, and 305D. Each memory channel has anindependent micro-tile memory controller to support the sub-channels ofthe memory channel. Each memory channel has an independent data bus. Forexample assuming a total data bit width of 64 bits for each data bus ofthe memory channels, each sub-channel is coupled to an independent setof 16 bits of the data bus. Sub-channel 3051 is coupled to data bitsD15-D0, sub-channel 305B is coupled to data bits D31-D16, sub-channel305C is coupled to D47-D32, and sub-channel 305D is coupled to data bitsD63-D48 as is illustrated in FIG. 31.

As previously discussed, some address signal lines may be shared intoeach of the sub-channels while other address signal lines areindependent from one sub-channel to the next, in one embodiment of theinvention. For example, address signal lines 310 (labeled Axx-A11,BA2-BA0) are shared to all sub-channels 305A-305D. That is, each of theaddress signal lines 310 may be fanned out and coupled into eachsub-channel. In contrast, address signal lines 311A (first set labeledA10-A6) are independently coupled into sub-channel 305A. Address signallines 311B (second set labeled A10-A6) are independently coupled intosub-channel 305B. Address signal lines 311C (third set labeled A10-A6)are independently coupled into sub-channel 305C. Address signal lines311D (fourth set labeled A10-A6) are independently coupled intosub-channel 305D.

Ideally, enough independent address lines are provided to allow fulladdressability within the allocated memory page size granularity. Thepage size is typically set by software managing the graphic memoryspace. For example consider the case of a 4 kilo-byte (KB) page sizeallocation in a two-channel cache-line interleaved memory subsystem, 2KB of the page are mapped to each memory channel. In which case, fiveaddress lines may be used to address thirty-two 64B cache lines in eachphysical page of memory. Thus, fifteen additional independent addresslines would be ideal for a four sixteen bit sub-channel implementation.These are shown as address signal lines 311B-D respectively labeled asthe second, third, and fourth sets of address lines labeled A10-A6 overthe original first set of address signal lines 311A labeled as the firstset of address lines A10-A6, if fewer additional independent addresslines are made available, the independent address space addressable byeach sub-channel is reduced. If more independent address lines are madeavailable into each sub-channel, the independent address spaceaddressable by each sub-channel is increased. To implement twothirty-two bit sub-channels, it is desirable to have five additionalindependent address lines.

Extra address signal lines may be routed between the memory controllerand the sub-channels to provide the independent address signal lines asillustrated in FIG. 3A. Address signals may be overloaded onto thepre-existing address lines. A combination of routing extra addresssignal lines and overloading of address signals may be used to supportmicro-tiling. Alternatively, each sub channel may be provided with acomplete set of independent address lines without the shared addresslines 310 illustrated in FIG. 3A. However, using the shared addresssignal lines 310 conserves printed circuit board area by avoiding therouting of independent address signal lines.

Referring momentarily to FIG. 6, an address signal line bit map for amemory channel is illustrated using shared and independent address bits.That is, FIG. 6 is an address bit map that illustrates theinterpretation of the address bits in a physical address from the leastsignificant bit (LSB) to the most significant bit (MSB). A set of Iindependent address bits (IAB) is provided to each sub-channel tosupport micro-tiling. A set of zero or more SA shared address bits (SAB)may be provided to all of the sub-channels. A set of Q sub-channelselect bits (SSB) are used in the assignment of a memory request to asub-channel. A set of P sub-channel data address bits (SDAB) are used toaddress the bytes in each cache-line within a DRAM memory. The set of PSDAB bits are typically the least significant bits of the address signalline map. The set of Q SSB bits and the P SDAB bits are not actuallyrouted between the memory controller and the sub-channel memory, itbeing understood that the base address of the block of data beingaccessed is an integer multiple of the burst size. That is, the P SDABbits may be generated internally by a memory integrated circuit such asby a DRAM device in accordance with double data rate (DDR) memoryspecifications. While FIG. 6 illustrates certain address bits beingchosen to be shared and independent address bits, other address bits maybe assigned instead. That is, the division of the address bits above theP sub-channel data address (SDAB) bits into the SA shared address (SAB)bits and the independent address (IAB) bits in general is arbitrary.

Referring now to FIGS. 4A-4C, idealized pixel map renderings of atriangle are illustrated using a tiled address space. FIG. 4Aillustrates the rasterization of the triangle 401 in a tiled addressspace using a non-micro-tiled memory system in which the logical channelwidth is 64 bytes. FIGS. 4B-4C illustrate the rasterization of thetriangle 401 in a tiled address space using a micro-tiled memory system.The unit of rasterization of the triangle 401 is a fragment 402. Afragment 402 may represent a pixel or a texel. A tiled address space isone in which a logically two-dimensional array of data is organized as aset of sub-arrays, such that the data within the subarray is stored in acontiguous range of the address space and are thus highly localized inmemory. A logically two-dimensional array of data that is linearlyaddressed has no such sub-arrays; instead, data such as fragments 402are addressed linearly across from left to right in a row and then downto the next row from top to bottom. Thus, vertically adjacent fragments402 may be far apart in memory.

In comparison with FIG. 4A, FIGS. 4B-4C show how micro-tile memoryaccesses provide the advantages of smaller memory requests. Each ofFIGS. 4A-4C show the rasterization of a triangle 401 for a differentmemory request size.

In FIG. 4A, a single memory request encompasses the data representing 16fragments. Each of the individual squares 402 represents a fragment,typically thirty-two bits or four bytes of data per fragment. FIGS.4A-4C illustrate a 20×20 array of fragments. A 4×4 array of fragments,as illustrated in FIG. 4A, is a span 404 and represents a sixty-fourbyte memory request. A subspan 424 is illustrated in FIG. 4C as a 2×2array of fragments or a sixteen byte memory request A double subspan 414is illustrated in FIG. 4B and is a 32 byte memory request that isoriented as a 2×4 array of fragments.

The differences between FIGS. 4A-4C illustrate the theoretical reductionin over-fetch as the memory request size decreases. In each of the FIGS.4A-4C, the triangle 401 requires access of the same number of fragments.However a memory access typically transfers the data of more than onefragment, such that it may include data representing fragments 408within the triangle 401 and fragments 406 outside the triangle 401. Datarepresenting fragments 406 outside of the triangle 401 are over-fetched,resulting in the inefficient use of the memory bandwidth.

In FIG. 4A, a 64 byte memory access transfers the data of a span 404, a4×4 block of fragments. For example, span 404A is a first 64 byte memoryaccess. Span 404B is a second 64 byte memory access. For exampleconsider that the triangle 401 encompasses approximately fifty-sevenpixels to render. For the 64 byte memory access case, ten memoryaccesses are needed to access the 65 fragments within the triangle. Dataof an additional 95 fragments is accessed but might not be used.

In FIG. 4B, a 32 byte memory access transfers the data of a doublesub-span, a 2×4 block of fragments or one-half of a 64 byte memoryaccess. For example, double subspan 414A is a first 32 byte memoryaccess. Double subspan 414B is a second 32 byte memory access. For the32 byte memory access case, thirteen memory accesses are needed toaccess the 65 fragments within the triangle. Data of an additional 47fragments is accessed but might not be used.

In FIG. 4C, a 16 byte memory access transfers the data of a sub-span, a2×2 block of fragments or one-quarter of a 64 byte memory access. A span424A is a first 16 byte memory access. A span 424B is a second 16 bytememory access. A span 424C is a third 16 byte memory access. A span 424Dis a fourth 16 byte memory access. For the 16 byte memory access case,twenty-two memory accesses are needed to access the 65 fragments withinthe triangle. Data of an additional 13 fragments is accessed but mightnot be used.

Consider as another example that the triangle 401 requires sixty-fivepixels or fragments (260 bytes) to display in each of FIGS. 4A, 4B and4C. In FIG. 4A, approximately ten spans of memory are accessed includingone-hundred sixty pixels or six-hundred forty bytes of data to rendertriangle 401. In FIG. 4B, approximately thirteen double subspans of dataare accessed including one-hundred twelve pixels or four-hundredforty-eight bytes of data to render triangle 401. In FIG. 4C,approximately twenty-two subspans of data are accessed includingeighty-eight fragments or three-hundred fifty-two bytes of data torender triangle 401. Thus in comparison with FIG. 4A, the over-fetchedpixels or fragments 406 are reduced in FIGS. 4B and 4C by implementingmicro-tile addressing with sub-channels within each memory channel.

As previously discussed, FIGS. 4B-4C illustrate the rasterization of thetriangle 401 in a tiled address space using a micro-tiled memory systemthat includes memory sub-channels. In FIG. 4B, a 64 byte wide memorychannel may be formed from two 32 byte wide memory sub-channels. In thiscase, a micro-tiled memory access combines two discontiguous 32 byteaccesses into a single 64 byte access, one on each of the twosub-channels for a total size of 64 bytes. Rasterization of the triangleresults in requests to access double subspans 414. For example, themicro-tile memory controller may combine requests to access doublesubspans 414C and 414D into a single micro-tiled memory access. Asanother example, the memory controller may combine requests to accessdouble subspans 414E and 414F into a single micro-tiled memory request.Other combinations of requests to access double subspans may be formedinto a single micro-tiled memory request or access. In one or moreembodiments of the invention, the combined sub-channel accesses have ashared address bit pattern in the SA shared address bits.

In FIG. 4C, a 64 byte wide memory channel may be formed from four 16byte wide memory sub-channels. In this case, a micro-tiled memory accesscombines four discontiguous 16 byte accesses into a single 64 byteaccess, one on each of the four sub-channels for a total size of 64bytes. Rasterization of the triangle results in requests to accesssubspans 424. For example, the micro-tiling memory controller maycombine requests to access subspans 424E, 424F, 424G, and 424H into asingle micro-tiled memory access. Other combinations of requests toaccess subspans may be formed into a single micro-tiled memory requestor access. In one or more embodiments of the invention, the combinedsub-channel memory accesses have a shared address bit pattern in the SAshared address bits for each of the four memory sub-channels.

In the ideal case, it is assumed that all micro-tiled memory requestscan be utilized by the micro-tile transaction assembler to build 64Bmemory transactions with no unused sub-channels. That is, theeffectiveness of micro-tiling depends on the ability of the transactionassembler 326A,326B to construct fully populated memory transactions.

Referring now to FIG. 3B, a multi-channel memory subsystem isillustrated including a micro tiled memory control block 300 coupled tothe system memory channels and one or more cache memory 203. Within thememory control block 300, the multi-channel memory subsystem includes amicro-tiling memory controller for each memory channel into systemmemory.

In FIG. 3B, two memory channels 304A and 304B are provided. Thus, twomicro-tile memory controllers 321A and 321B are provided for therespective memory channels 304A and 304B. Each memory channel 304A,304Bmay be composed of S sub-channels 305A-305S. Each sub-channel 305 islogically N bytes wide and B bits wide. Each memory channel 304 islogically M=N*S bytes wide.

Between the memory control block 300 and the cache memory 203 is a writedata path 301 and a read data path 302 that can include command paths oraddress paths over which read and write requests can be made. N bytesare returned to the cache 203 from the memory control block 300 over theread data path 302 in the case of a read transaction. An N byte writerequest is provided from the cache 203 to the memory control block 300over the write data path 301 in the case of a write transaction. Whilean N byte read or write request is made between the cache 203 and thememory control block 300, requests are depicted as arrays of 2×2 tilesto represent a 2×2 array of pixels or texels, such as my be used withfour sub-channels.

The memory control block 300 includes a channel assignor 320, a firstmemory controller 321A, and a second memory controller 321B. The memorycontrol block 300 is also coupled to memory channel zero 304A and memorychannel one 304B. Memory channel zero 304A includes “S” sub-channels305A-305S. Similarly, memory channel one 304B includes “S” sub-channels305A-305S. Shared address lines 310 couple from each memory controller322 into each sub-channel 305A-305S. Independent address lines 311A-311Scouple into the respective sub-channels 305A-305S. Each of the data bussub-channel portions 312A-312S is coupled into the respective memorysub-channels 305A-305S.

Each of the memory controllers 321A and 321B include a sub-channelassignor 322A-322B, a reorder buffer 324A-324B, and a transactionassembler 326A-326B respectively.

The memory request for N bytes of data, the logical width of a channel,is coupled into the channel assignor 320. The channel assignor assignsthe memory request to either of memory channel 0 304A or memory channel1 304B depending upon the circumstances including the variability of thememory channel. After being assigned to a memory channel by the channelassignor, the N byte request is coupled into the respective memorycontroller 321A or 321B and into the sub-channel assignor 322A or 322B.

The sub-channel assignor 322A and 322B assigns the N byte requests toone of the sub-channels 305A-305S. Referring momentarily to FIG. 6, theIdentity Sub-channel Assignment, s, may be defined by the followingprocess: (1) The request address, “A”, is shifted right by the P SDABbits, resulting in a new integer value Ã (where, Ã=A>>P). (2) The value“s” for the Sub-channel Assignment is the least significant Q SSB bitsof Ã (e.g., s=Ã& ((1<<Q)−1)).

Each of the micro-tiling memory controllers 321A-321B has a reorderbuffer 324A-324B, respectively. The reorder buffer reorders the memoryrequest into the sub-channels so as to increase the bandwidth efficiencyin each memory channel. A request to read or write a block of N bytes ofdata at address “A” enters the memory controller 322A or 322B, isassigned to a sub-channel, and is placed in the reorder buffer. Thereorder buffer may be implemented as a reorder queue for eachsub-channel. Other implementations of the reorder buffer are possible.

The transaction assembler 326A,326B forms a memory read transaction byselecting S read requests, one for each sub-channel, from the reorderbuffer, such that all S requests have the same shared address bits. Itforms a memory write transaction by selecting S write requests, one foreach sub-channel, from reorder buffer, such that all S requests have thesame shared address bits. For example, the transaction assembler326A,326B may assemble a 64 byte transaction in a memory channel fromfour 16 byte requests, one to each sub-channel.

When attempting to form a transaction, the transaction assembler in amicro-tiled controller may not be able to find a concurrent set ofrequests, one for each sub-channel, such that the SA shared address bitsare the same across all sub-channels. In such a case, no data may betransferred on a sub-channel for which a request was not found, or ifdata is transferred over that sub-channel, the data can be discarded.

Referring now to FIGS. 5A-5C, exemplary byte ordering is illustrated foreach memory channel 500A-500C. In FIG. 5A, memory channel 500A has atransfer size of 64 bytes numbering from 0 to 63. The logical width of64 bytes may be accessed by a 64 bit physical width of memory channel.

In FIG. 5B, memory channel 500B may be divided into two memorysub-channels 505A and 505B, each of which transfers one-half of a 64byte transfer, so that each sub-channel transfers 32 bytes. For memorysub-channel 505A, the memory bytes are that are accesses number from 0to 31, reordered from that of FIG. 5A. For memory sub-channel 50513, thebytes that are accessed are numbered from 32 through 63, reordered fromthat of FIG. 5A.

In FIG. 5C, the memory channel 500C may be divided into four memorysub-channels, 515A, 515B, 515C, and 515D, each of which transfersone-fourth of a 64 byte transfer, so that each sub-channel transfers 16bytes. Memory sub-channel 515A accesses memory bytes numbering from the0 to 15, reordered from that of FIG. 5A. Memory sub-channel 515Baccesses memory bytes 16 through 31, reordered from that of FIG. 5A.Memory sub-channel 515C accesses byte numbers 32-47, reordered from thatof FIG. 5A. Memory sub-channel 515D accesses byte numbering 48-63,reordered from that of FIG. 5A. In this manner, a 64 byte transfer isequally distributed across each of the memory sub-channels while thebyte numbers are reordered and assigned.

Referring now back to FIG. 6, the bytes may be reordered differently inother embodiments of the invention.

As discussed previously, to support micro tile memory access, SA sharedaddress bits may be utilized along with I independent address bits whilethe Q sub-channel select bits and P sub-channel data address bits areutilized to address the physical bytes accessed by a cache-line. For a64 byte cache-line, the sum of Q sub-channel select bits and Psub-channel data address bits is 6.

In FIG. 6, we indicate the P sub-channel data address bits as beingA0-A8. On FIG. 6, the Q sub-channel select bits are labeled A10, A8 andany more there in between. In FIG. 6, the I independent address bits arelabeled A9, A10, A16, A18, A24 and any more there in between. FIG. 6,the SA shared address bits are labeled as A11, A15, A17, A19, A20, A25,A26, and Ax for example. Additional shared address bits may be used inbetween.

With the I independent address bits, the sub-channel ac dresses areindependent within an address offset of each other. To make thesub-channels independent from each other, a complete duplication of thecommand and address from the memory controller to each sub-channel maybe used but would significantly increase the memory controller pincount, the silicon area for input/output drivers, and the wire routingarea needed over a host printed circuit board or motherboard. Instead,embodiments of the invention share one or more portions of thesub-channel address bits across all sub-channels and permit theremainder, I, to be independent for each sub-channel, as depicted inFIG. 6. A judicious choice of the I independent address bits cantherefore provide increased bandwidth efficiency, balanced against thecost of duplicating I address signals to each sub-channel.

As discussed previously, the I independent address bits may be obtainedin different manners including routing additional address lines to eachmemory sub-channel and/or using address overloading.

Referring now to FIG. 7, a memory module (MM) 710 is illustrated that isexemplary of the memory modules MM1-MMn. The memory module 710 may be ofany type such as a single inline memory module (SIMM) or a dual inlinememory module (DIMM), for example. The memory module 710 includes memoryintegrated circuit chips (“memory devices”) 752 coupled to a printedcircuit board 751. The printed circuit board 751 includes an edgeconnector or edge connection 754 that couples to an edge connector 760or other type of connector of a host printed circuit board 762. The edgeconnector or edge connection 754 of the printed circuit board 751 isformed of a plurality of metal pads that can also be referred to aspins. One metal pad of the edge connection 754 is a VCC or power pad.Another one of the metal pads of the edge connection 754 is a VSS orground pad. In an alternate embodiment of the invention, the edgeconnection 754 may be an edge connector with pins instead of metal padswith one pin being a VCC or power pin and another pin being a VSS orground pin. Collectively, the edge connector and edge connection may bereferred to herein as an electrical connector 754 with connectors thatmay be pins, pads, or a combination of both.

The memory module 710 supports micro-tiling and micro-tile memoryaccesses. To support micro-tiling of memory, additional address signallines may be independently supplied to the memory integrated circuits752 by using the unused or no-connect pins of the pinout of the edgeconnection 754 of the printed circuit board 751, in one embodiment ofthe invention. These unused or no-connect pins of the edge connection754 may be used to route additional independent address signal lines tothe memory integrated circuits 752. The same unused pins are found inthe corresponding edge connector 760 mounted to the motherboard 762.Additional independent address signal lines 763 are routed across themotherboard 762 to the pre-existing connector from the memory controllerin the memory control block to supply the additional independent addressinformation. A number of different types of unused or no-connect pins ofthe pinout of the edge connection 754 of the memory module may be found.

For example, parity or an error correction code (ECC) function may havepins reserved as part of the pin-out for the edge connection 754. Tolower the costs of memory modules to consumers, parity and ECC functionsare often left off the memory module so that the reserved signal linesand pins often go unused. That is, the parity/ECC signal lines may berouted into all edge connectors of the motherboard, but are only usedwhen ECC enabled memory modules (e.g., dual inline memory modules(DIMMs)) are installed therein. The unused pre-existing ECC lines/pinsof the memory module are retargeted as independent address signal linesused to implement micro-tiling in non-ECC memory modules. However inusing the ECC lines/pins for micro-tiling, both ECC and micro-tilingfunctions cannot be enabled at the same time on a memory module. Thissolution works well in environments that don't typically need (or want)parity/ECC to be enabled.

As another example, optional active low data signal lines that arereserved in the pin-out for the edge connection 754 often go unused asthey are redundant of the active high signal lines which are provided.As yet another example, optional test pins reserved within a pin-out forthe edge connection 754 of the memory module often go unused as thattest mode may not be used.

In any case, these unused pins are retargeted to be independent addresssignal pins 755A-755D and independent address signal lines 763 arerouted on the host printed circuit board 762 and independent addresssignal lines 756A-756D are routed on the PCB 751 of the memory module710 to the memory integrated circuits 752.

In some cases, the memory module 710 may further include a supportintegrated circuit 750 such as a buffer integrated circuit (“buffer”) oran error correction control (ECC) integrated circuit. However asdiscussed previously, if ECC is not provided on the memory module 710,pins of the edge connection 754 that would have been otherwise reservedfor ECC and are unused may be used for independent address lines into amemory sub-channel to support micro-tiling.

To support micro-tiling and independent addressing of memorysub-channels, the memory integrated circuits 752 on the memory model 710may be divided up and assigned to the different memory sub-channels,such as the four memory sub-channels 205A, 205B, 205C, and 205D asillustrated in FIG. 7. The data I/O of a memory integrated circuit 752is typically 4, 8 or 16 bits wide. For a physical width of sixty-fourbits for a memory channel and sixteen bits for each memory sub-channel,four sixteen bit wide memory integrated circuits 752 would berespectively assigned one-to-one to the four memory sub-channels 205A,205B, 205C, and 205D. Eight eight-bit wide memory integrated circuits752 would be respectively assigned two at a time to the four memorysub-channels 205A, 205B, 205C, and 205D to provide a physical width ofsixty-four bits for a memory channel and sixteen bits each memorysub-channel. Sixteen four-bit wide memory integrated circuits 752 wouldbe respectively assigned four at a time to the four memory sub-channels205A, 205B, 205C, and 205D to provide a physical width of sixty-fourbits for a memory channel and sixteen bits each memory sub-channel.

In the case of two memory sub-channels, four sixteen bit wide memoryintegrated circuits 752 would be respectively assigned two at a time tothe two memory sub-channels for a physical width of sixty-four bits fora memory channel and thirty-two bits for each memory sub-channel. Eighteight-bit wide memory integrated circuits 752 would be respectivelyassigned four at a time to the two memory sub-channels for a physicalwidth of sixty-four bits for a memory channel and thirty-two bits foreach memory sub-channel. Sixteen four-bit wide memory integratedcircuits 752 would be respectively assigned eight at a time to the twomemory sub-channels for a physical width of sixty-four bits for a memorychannel and thirty-two bits for each memory sub-channel.

By using the unused pins of the edge connection 754 of the memory moduleand a standard edge connector 760, the memory module 710 can be backwardcompatible with pre-existing memory subsystems.

Consider FIG. 3A for example where four independent memory sub-channelsare found in each memory channel. An additional independent four addresslines may be provided per sub-channel to independently access an area ofmemory in each sub-channel. Address lines 311A-311D (labeled A9-A6) areindependent within each sub-channel. Given that one set of four addresslines pre-exists, the total number of additional address lines that areto be routed is three time four or twelve independent address signallines. Routing additional signal lines over a motherboard to a memorymodule my be used to add the independent address signaling when thepinout of a pre-existing edge connector and memory module is not fullyutilized.

Referring now to FIG. 8, a block diagram of a memory integrated circuit800 is illustrated. The memory integrated circuit 800 may be included inthe memory modules MM1-MMn as the one or more memory devices 752. Thememory integrated circuit 800 includes a memory array 801, a row addressdecoder 802, bitline precharge/refresh logic 803, a column decoder 804,a sense amp array and write driver block 806, a controller 808, anaddress buffer 811, and micro-tile control logic 812 coupled together asshown. The micro-tile control logic 812 may also be referred to asoverload logic (OL).

The controller 808 includes a mode register 810 with a plurality of bitsthat can be set/initialized to control the general functionality of thememory integrated circuit 800. The mode register includes bit storagecircuits to store the bits. The bits of the mode register 810 may be setby applying the appropriate bit settings on address lines 820 or datalines 821 coincident with a load strobe. The load strobe may begenerated by toggling one or more of the control lines 822 that arecoupled into the controller 808 of the memory integrated circuit whenthe memory is idle. The controller 808 receives one or more of thecontrol lines 822. The one or more control lines 822 may include rowaddress strobe RAS #, column address strobe CAS #, write enable WE #,chip select CS #, bank selects BA0, BA1, BA2, RESET RST #, clock CLK,and other standard memory integrated control inputs. The control signalson the one or more control lines 822 may be active low signals or activehigh signals. Active low signals indicate an inverted true conditionwhile active high signals indicate a non-inverted true condition.

More specifically, the mode register 810 may be used to configure theintegrated circuit 800 for micro-tile memory access. As will bediscussed further below, one of the bits of the mode register 810 is amicro-tile enable bit (MTE) 850. The micro-tile enable bit 850 may beactive high and referred to as MTE bit. Alternatively, the micro-tileenable bit 850 may be active low and referred to as MTE #. In eithercase, the micro-tile enable hit may generally be referred to as themicro-tile enable bit 850 or the MTE bit 850. The micro-tile enable bit850 is reset by default such that micro-tiling is disabled when thedevice is initially powered-up or reset. This allows the memory module710 and the memory integrated circuit 800 to be backward compatible wheninserted into systems that do not support micro-tiling. The moderegister 810 further has one or more sub-channel select (SCS) bits 851to indicate the memory sub-channel to which the memory integrated isassigned and addressable. The MTE bit 850 and the one or more SCS bits851 are coupled into the micro-tile control logic 812.

While a load strobe may be generated by a load mode register command andused to load bit settings into the mode register, a new command may beintroduced to read out the bit settings in the mode register from thememory integrated circuit. A status command may be provided to thememory integrated circuit to read out the bits of the mode register. Thestatus command may be formed by uniquely toggling or setting the one ormore of the control lines 822 that are coupled into the controller 808of the memory integrated circuit when the memory is idle. In this case,the MTE bit 850 could be read out from the memory integrated circuitsthat support micro-tiling.

The micro-tile control logic 812 is coupled to a plurality of addresssignal lines 820 so as to couple addresses to the column address decoder804 and/or the row address decoder 802 through the address buffer 811.The address buffer 811 may latch the address signals on the internaladdress signal lines to hold them for the address decoders. The controllogic 812 is also coupled to the mode register of the controller toreceive the micro-tile enable bit and at least one sub-channel selectbit in order to support micro-tile memory accesses into the memory array801. In response to the micro-tile enable bit and the at least onesub-channel select bit, the control logic 812 selects one or more of theaddress signal lines over which to capture independent addressinformation for a predetermined sub-channel to which it is assigned.That is, only a subset of the address signal lines may be assigned to apredetermined sub-channel. The control logic 812 selects this subset ofaddress signal lines to extract the independent address information.Other address signal lines may be used for other sub-channels or somemay be shared address signal lines into each sub-channel. The controllogic 812 couples the independent address information into the columnaddress decoder 804 and/or the row address decoder 802. The selection ofthe one or more address signal lines by the control logic may be furtherresponsive to a column address load signal (CAS #) and a transactionenable signal.

Additional control logic may be added into and around the micro-tilecontrol logic 812 in order to further swizzle the independent addressinformation for one significant bit to another significant bit position.This is to provide a somewhat linear addressing method, such as forscreen refresh, when micro-tiling is enabled.

The sense amp array and write driver block 806 couples to the datainput/output (I/O) bus and may receive control signals from thecontroller 808 to read data from the memory array or write data into thememory array 801. The sense amp array and write driver block 806receives data to be written into the memory array 801 and drives dataout that has been read from the memory array 801 over the datainput/output (I/O) bus 821. The data input/output (I/O) bus 821 includesbidirectional data lines of the memory integrated circuit 800 that aretypically 4, 8 or 16 bits wide.

The memory array 801 consists of memory cells that may be organized inrows and columns. The memory cells are typically dynamic random accessmemory (DRAM) cells but can optionally be a static type of random accessmemory (SRAM) cell or a non-volatile programmable (NVRAM) type ofre-writeable memory cell.

The row address decoder 802 receives a row address on the address linesand generates a signal on one of the word lines (WL) in order to addressa row of memory cells in the memory array 801. The column decoder 804also receives a column address on the address lines and selects whichcolumns within the row of memory cells are to be accessed. The columndecoder 804 essentially selects bitlines into memory cells that are tobe accessed. In a read access, the column decoder 804 functions as amultiplexer. In a write access, the column decoder 804 functions as ade-multiplexer. The column address decoder 804 selectively accessescolumns of memory cells within the memory array 801 in response toshared column address signals and if the micro-tile enable bit withinthe mode register is set, the column address decoder 804 selectivelyaccesses columns of memory cells within the memory array 801 further inresponse to independent sub-channel column address signals.

The sense amp array and write driver block 406 may include senseamplifiers to determine whether a logical one or logical zero has beenstored within the accessed memory cells during a read operation. Theaddressed memory cells try to drive a logical one or logical zero ontothe selected bitlines of the memory array during the read operation. Thesense amplifiers detect whether a logical one or logical zero has beendriven out by the addressed memory cells onto the selected bitlines ofthe memory array during the read operation. The sense amp array andwrite driver block 406 may further include write drivers to drive alogical one or logical zero onto the selected bitlines of the memoryarray and into the addressed memory cells during a write operation.

The precharge/refresh block 803 couples to the bitlines in the memoryarray 801. The precharge/refresh block 803 may precondition the bitlinesprior to addressing the memory cells during a read or write operation.The precharge/refresh block 803 may also refresh the data stored in thememory cells of the memory array 801 during periods of inactivity.

During specific memory cycles, some existing signal lines into thememory integrated circuit 800 are not used and can be re-targeted duringthis time for other purposes. For example during CAS (Column addressstrobe) cycles, not all the address lines are used. These unused addresssignal lines can be retargeted during the CAS cycle to communicateadditional address information to the memory modules (e.g., DIMMs) andthe memory integrated circuit devices therein. The memory controller 208in the memory control block 202 sends additional address informationover these unused address signal lines during the CAS cycle. The memoryintegrated circuit 800 with the added micro-tile control logic circuitry812 and bits within the mode register 810 recognizes and decodes theseoverloaded signals on the previously unused address signal lines thatwere unused during the CAS cycles.

Referring now to FIG. 9, to support micro-tiling exemplary micro-tilememory control logic 812A coupled to a mode register 810A within amemory integrated circuit is illustrated. The exemplary implementationof the micro-tile memory control logic 812A decodes overloaded addresssignal lines that have additional address information provided duringunused memory cycles, such as a CAS cycle. The schematic diagram of themicro-tile memory control logic 812A assumes that four sub-channels areprovided each of which has a logical width of sixteen bytes to supportmicro-tiling.

Central to the micro-tile memory control logic 812A is a dual four inputmultiplexer 900 to capture the independent address information. The dualfour input multiplexer 900 of the micro-tile memory control logic 812Aselectively outputs shared column address signals or independentsub-channel column address signals on the multiplexed output (A3′ andA4′). The outputs (A3′ and A4′) of the dual four input multiplexer arecoupled to the input of the column address decoder. The independentsub-channel column address signals are the one or more independentcolumn address signals that have been selected to be received by therespective memory sub-channel.

The micro-tile control logic 812A receives the address lines fromaddress pins of the memory integrated circuit. The micro-tile controllogic 812A provides addresses to the address buffer to be distributed tothe row address decoder and the column address decoder. Some of theaddress pins of the memory integrated circuit receive shared row addresssignals, shared column address signals, independent column addresssignals, or a combination thereof. For example, address pins A5-A9 andA13 pass around the micro-tile control logic 812A and may receive sharedrow address signals and/or shared column address signals into each ofthe memory sub-channels. Address pins A0-A4 and A10-A12 are coupled intothe dual four input multiplexer 900 and may receive shared row addresssignals and independent column address signals if micro-tiling isenabled. If micro-tiling is not enabled, address pins A3 and A4, coupledinto the dual four input multiplexer 900, may receive shared row addresssignals and/or shared column address signals. A column address loadstrobe pin CAS # is coupled to the control logic 812A to receive acolumn address load strobe signal and selectively receive theappropriate one or more of the independent column address signals on theaddress pins assigned to a given sub-channel for capture inside thememory integrated circuit. The column address load strobe signal mayalso be used to receive and capture the shared column address signalsoff of the appropriate address pins.

The mode register 810A may include three bit storage circuits such as aflip flop or memory cell to store settings of a micro-tile enable (MTE)bit, a sub-channel select bit zero (SCS0) bit, and a sub-channel selectbit one (SCS1) bit. These three bits in the mode register 810A areprogrammed with the appropriate sub-channel select bits and micro-tileenable bits. These three bits are set/reset from BIT SETTINGS that thememory integrated circuit receives during initialization such as atpower-up or reset. These three bits may also be set/reset when thememory integrated circuit is idle with no memory access in progress. TheBIT SETTINGS may be received over the address or data signal lines andloaded into the mode register in response to a LOAD STROBE signalgenerated by one or more control line inputs coupled into the memoryintegrated circuit. If micro-tiling is to be enabled in the memoryintegrated circuit, the micro-tile enable bit MTE is set. As the MTE bit850 is active high, it is set to a high logic level. If active low, theMTE # bit 850 is set to a logic low level. In the exemplary controllogic of FIG. 9, there are possibly four or less sub-channels within amemory channel. The SCS0 and SCS1 bits assign the memory integratedcircuit to one of four memory sub-channels. Other memory integratedcircuits on the same memory module may be assigned to another one of thefour memory sub-channels.

Independent address information for each of the sub-channels is madeavailable over the pre-existing address lines, such as address linesA0-A4 and A10-A12, during the CAS cycle. In this example, address linesA3 and A4 are ordinarily used. Thus, address lines A0, A1, A2, A10, A11,A12, and A13 are overloaded signal lines (A13 may be the micro-tiletransaction enable—specified on a transaction basis). This method ofoverloading signal lines on existing address lines in effect providessix additional address lines (A0-A2 and A10-A12) to the memoryintegrated circuit devices without the use of additional traces (i.e.,wire routing) or the use of additional pins.

The micro-tile memory control logic 812A is provided in each memoryintegrated circuit so that proper independent sub-channel addressinformation is selected from the address lines A0-A4 and A10-A12 inresponse to the sub-channel select bits (e.g., SCS0 851A and SCS1 851B)stored in the mode register. The settings of the sub-channel select bits(e.g., SCS0 851A and SCS1 851B) are routed from the mode register 810Ato the micro-tile memory control logic 812A to control the inputselection process of the multiplexer 900. The output terminals of themultiplexer 900 are coupled to address signal lines A3′ and A4″. Addresssignal lines A3′ and A4′ are coupled to an address decoder (e.g., columnaddress decoder 804) to select memory cells within the memory array.

The micro-tile control logic may overload the memory address signallines A3′ and A4′ during the column address write access time when CAS #is active low (“CAS cycle”). That is, address bits A0, A1, A2, A10, A11and A12 are normally unused address bits when the column address isbeing written to the memory integrated circuit without micro-tiling.Address bits A3 and A4, substituted by A3′ and A4′, are address bitsthat are used to write the column address to the memory integratedcircuit. While address bits are normally unused without micro-tilingduring the CAS cycle, they may be used to select the row address in amemory integrated circuit when the row address is being written into thememory integrated circuit when RAS # is active low (“RAS cycle”). Thisis referred to herein as address overloading. White A0, A1, A2, A10, A11and A12 are illustrated as being the unused address bits during columnaddress strobe CAS # in FIG. 9, different unused address bits may beutilized as the overloaded address signal lines to support micro-tiling.

The micro-tile memory control logic 812A includes the dual four inputmultiplexer 900, a three input AND gate 903, a plurality of two inputAND gates 904-911, and a plurality of inverters 912-918 coupled togetheras shown. It is well understood that an AND gate may be formed by thecombination of a NAND gate with an inverter having its coupled to theoutput of the NAND gate.

The dual four-input multiplexer 900 is a pair of four to onemultiplexers each having a first select control input S0 coupledtogether and a second select control input S1 coupled together. Thefirst four to one multiplexer receives inputs 1I0-1I3 and provides theoutput 1Y in response to the select control inputs S0 and S1. The secondfour to one multiplexer receives inputs 210-213 and provides the output2Y in response to the select control inputs S0 and S1. If S0 and S1 areboth logical low or zero, the inputs 110 and 210 are multiplexed ontothe respective outputs 1Y and 2Y. If S0 is a logical high or one and S1is a logical low or zero, the inputs 1I1 and 2I1 are multiplexed ontothe respective outputs 1Y and 2Y. If S0 is a logical low or zero and S1is a logical high or one, the inputs 1I2 and 2I2 are multiplexed ontothe respective outputs 1Y and 2Y. If S0 and S1 are both logical high orone, the inputs 1I3 and 2I3 are multiplexed onto the respective outputs1Y and 2Y.

The first four-input multiplexer of the dual four-input multiplexer 900receives the address bits A3, A0, A1, and A2 at its respective 1I0-1I3inputs and selects one of them to be driven onto the address signal lineA3′ at its 1Y output. The second four-input multiplexer receives addressbits A4 and A10-A12 at its respective 2I0-2I3 inputs and selects one ofthem to be driven onto the address signal line A4′ at its 2Y output. Theselect control inputs S0 and S1 are respectively coupled to the outputsof the AND gates 904-905.

The AND gate 903 generates a micro-tile mode signal (MTM) 902A at itsoutput. The micro-tile mode signal 902A is active high and generated atthe appropriate time when the independent address signals are on theoverloaded address signal lines coupled into the dual four-inputmultiplexer 900. Inverter 912 inverts the active low CAS # signal intoan active high CAS signal at its output which is coupled into an inputof the AND gate 903. AND gate 903 logically ands the CAS signal, the MTEbit setting (ME), and the transaction enable signal (TE, address bitA13) to generate the micro-tile mode signal 902A. That is if micro-tileis enabled by the MTE bit and the transaction is enabled by the TEsignal, the micro-tile mode signal (MTM) 902A is generated when CAS #goes low.

The micro-tile mode signal (MTM) 902A is coupled into the inputs of ANDgates 904 and 905 to gate the sub-channel select bits SCS0 851A and SCS1851B. If the micro-tile mode signal (MTM) 902A is low for any reason,the select controls S0 and S1 into the multiplexer 900 are logically lowor zero at the output of the AND gates 904 and 905. With S0 and S1 beingboth logical low or zero, the address bits A3 and A4 respectivelycoupled to the inputs 110 and 210 are respectively multiplexed onto theaddress signal lines A3′ and A4′ at the respective outputs 1Y and 2Y.Bits A3 and A4 merely pass through to signal lines A3′ and A4′respectively. This is the default condition if micro-tiling is notenabled or if bits A3 and A4 are used for any other purpose, such as rowaddressing.

When the micro-tile mode signal (MTM) 902A is active high, thesub-channel select bits SCS0 and SCS1 are respectively coupled into theselect control inputs S0 and S1 of the multiplexer 900 by passingthrough the AND gates 904 and 905, respectively. Thus, when themicro-tile mode signal (MTM) 902A is generated to be active high by theAND gate 903, the sub-channel select bits SCS0 and SCS1 control theselection of the multiplexing of the respective four inputs to therespective outputs of the multiplexer 900. Effectively the settings ofthe sub-channel select bits SCS0 and SCS1, indicating the sub-channel towhich the memory IC may be assigned, determines which address bit linescoupled into the multiplexer 900 are used to capture the independentaddress signals during the CAS cycle.

The settings of the sub-channel select bits SCS0 and SCS1 will vary fromone sub-channel to the next. For four sub-channels, there are fourdifferent settings for SCS0 and SCS1 respectively. Note however thatmicro-tile control logic designed to support four sub-channels can bereadily reduced to support two sub-channels by using only two differentsettings of the sub-channel select bits SCS0 and SCS1. With thedifferent settings for SCS0 and SCS1, the multiplexer 900 selectsdifferent address signal lines to capture the independent addresssignals when the micro-tile mode signal is generated.

The micro-tile mode signal (MTM) 902A is also coupled into the inverters913-918 at a first input to the AND gates 906-911, respectively. Theaddress signals A0, A1, A2, A10, A11, and A12 are respectively coupledinto the second input of the AND gates 906-911. The micro-tile modesignal (MTM) 902A effectively gates the signals on the address lines A0,A1, A2, A10, A11, and A12 into the memory integrated circuitrespectively at the outputs A0′, A1′, A2′, A10′, A11′, and A12′ of theAND gates 906-911. That is, when the micro-tile mode signal (MTM) 902Ais logically low or zero, the AND gates 906-911 allow the signals onaddress lines A0, A1, A2, A10, A11 and A12 to pass through onto theoutputs A0′, A1′, A2′, A10′, A11′, and A12′ and to the address decoders.When the micro-tile mode signal (MTM) 902A is logically high or one, theAND gates 906-911 drive all the outputs A0′, A1′, A2′, A10′, A11′, andA12′ to logical low or zero. Thus when the micro-tile mode signal (MTM)902A is active high to capture the independent address information, theoutputs A0′, A1′, A2′, A10′, A11′, and A12′ are not used as they are alldriven to zero.

Loading Identity Values into Memory ICS

Memory integrated circuits may include latches or bit registers to storean identity value. The identity value may be combined with additionalfunctionality to give each memory integrated circuit in a memory channela unique “personality”. The additional functionality may includecircuitry that is conditioned by the identity value. The identity value,assigned to each memory integrated circuit in a memory channel andmemory module, may be an arbitrary value or a predetermined value. Theidentity value may be unique to each memory integrated circuit orestablish groups of memory integrated circuits having the same identityvalue.

The identity value may be identity bits hard wired into dedicated pinsof a memory integrated circuit. The identity value may be loaded into anumber of bits in an existing mode register of a memory integratedcircuit, such as found in dynamic random access memory (DRAM) integratedcircuits. Alternatively, the identity value may be loaded into a numberof bits of a newly defined register. The register to store the identitybits of the identity value can be a write-only register, or the registercould be locked after an initial write, or at any time during or afteran initialization process.

In micro-tiled memory channels, the identity value of each memory moduleis the sub-channel to which it is assigned. The identity bits of theidentity values are stored in the sub-channel select bits, such assub-channel select bits SCS0 851A and SCS1 851B, described previously.

The identity value in the memory integrated circuit is programmableoutside of the factory. That is, the integrated circuit manufacturerdoes not load the identity value into the memory integrated circuit atthe factory. The identity value is stored or loaded into each memoryintegrated circuit in various ways outside of the factory, aftermanufacturing of the memory integrated circuit is completed.

In one embodiment of the invention, the bits of the identify value areset by hard-wiring power or ground into sub-channel select pins of thememory integrated circuits mounted on the memory modules. The memoryintegrated circuits may receive the identity bit values internally byway of a buffer or alternatively they may be loaded into a register by aload strobe. In another embodiment of the invention, the bits of theidentity value are set onto data bit lines of a data bus and are loadedinto a register after a predetermined number of clock cycles followingreset of the memory integrated circuit. In yet another embodiment of theinvention, the bits of the identity value are set onto data bit lines ofa data bus and loaded into a register in response to the setting of anenable bit, such as a micro-tile enable bit or a mode enable bit, orother load signal. In still another embodiment of the invention, thebits of the identity value are set onto address bit lines of an addressbus and are loaded into a register using a data qualifier toindividually program memory integrated circuits, such as dynamic randomaccess memory integrated circuit components.

To set the identity value by hardwiring, wire jumpers are used on amemory module. In this case, each memory integrated circuit includesdedicated identity bit input pins as added input pins to its pinout. Theidentity bit input pins are tied to a high logic level (a.k.a., alogical one) or a low logic level (a.ka., a logical zero) to set theidentity value onto the pins of the integrated circuit. The identity bitvalues set on the identity input pins may be loaded into the memoryintegrated circuit in various ways. In micro-tile memory, the identitybit input pins are the sub-channel select input pins S0, S1 to set whatsubchannel the memory device may be assigned.

Referring now to FIGS. 10A-10C, memory modules 1010A-1010C areillustrated being programmed with identity values by being hard wired topower or ground. FIGS. 10A-10B illustrate memory modules 1010A-1010Brespectively using jumper wires to selectively couple power or groundinto the sub-channel select input pins S0, S1 (a.k.a., identity inputpins) of each memory integrated circuit. In FIG. 10C, packaged switchesmounted to the memory module 1010C selectively couple power or groundinto the sub-channel select input pins S0, S1 (a.k.a., identity inputpins) of each memory integrated circuit.

Setting a value of logic 0,0 on the identity input pins S1,S0respectively represents an identity value of zero. Setting the identityinput pins S1,S0 to logic 0,1 respectively represents an identity valueof one. Setting the identity input pins S1,S0 to logic 1,0 respectivelyrepresents an identity value of two. Setting the identity input pinsS1,S0 to logic 1,1 respectively represents an identity value of three.While a pair of identity input pins have been illustrated and described,additional dedicated identity input pins can be provided to each memoryintegrated circuit to enable the use of a larger range of differingidentity values.

In FIG. 10A, memory module 1010A includes memory integrated circuits752A-752D coupled to a printed circuit board 751. The memory integratedcircuits 752A-752D are electrically coupled to the pads forming the edgeconnection 754 of the printed circuit board 751. Memory module 1010A isprogrammed so that its memory integrated circuits 752A-752D are assignedto two memory sub-channels 250A-250B. The identity values are programmedinto the memory integrated circuits by using jumper wires 1002A-1002D,1004A-1004D, 1006A-1006B, 1007A, and 1008B coupling the identity inputpins S0,S1 to either power (VCC) 1001 or ground (VSS) 1000 asillustrated. The bits set on the identity input pins S0,S1 may bereferred to as identity bits S0,S1. The identity bits S0,S1 representthe arbitrary identity values that may be loaded or programmed into aregister with one or more flip-flops or one or more latches in eachmemory integrated circuit.

Each of the memory integrated circuits 752A-752D may have at least twoextra pins, identity input pins S0 1010 and S1 1011. The identity valuesare stored by setting the input pins S0 1010 and S1 1011 to either power(VCC) 1001 or to ground (VSS) 1000.

In FIG. 10A, the identity input pins S0, S1 of memory integratedcircuits 752A-752B are both set to zero or by the jumper wires1002A-1002B, 1004A-1004B, 1006A, and 1007A. The center jumper wire 1007Acouples the identity input pins S0 and S1 together. This programs memoryintegrated circuits 752A-752B of the memory module to be assigned to afirst memory sub-channel 250A, sub-channel 0.

Memory integrated circuits 752C-752D in FIG. 10A have their identityinput pins S1 set to zero by being coupled to ground (VSS) 1000 and havetheir identity input pins S0 set to one by being coupled to power (VCC)1001. The identity input pins S1 of the memory integrated circuits752C-752D are coupled to ground through jumper wires 1004C, 1004D, and1006B coupled to ground (VSS) 1000. The identity input pins S0 of thememory integrated circuits 752C-752D are set to one by the juniper wires1002C-1002D and 1008V coupled to power (VCC) 1001. This programs memoryintegrated circuits 752C-752D of the memory module to be assigned to asecond memory sub-channel 250B, sub-channel 1.

In this manner, memory integrated circuit devices 752A-752B have theiridentity input pins S0, S1 both tied low to VSS or ground to set them toa logic 0,0, respectively, or an Identity Value of 0. Memory integratedcircuit devices 752C-752D have their identity input pins S0, S1 set tologic 0,1, respectively, or an Identity Value 1.

In FIG. 10B, the memory integrated circuits 752A-752D of the memorymodule 1010B are assigned through their identity values to four memorysub-channels 250A-250D.

Memory integrated circuit 752A has its identity value set to zero byhaving both of its identity input pins S1 and S0 set to zero by beingcoupled to ground (VSS) 1000. The S0 and S1 identity input pins of thememory integrated circuit 752A are coupled to ground (VSS) 1000 throughthe jumper wires 1002A′, 1004A, and 1006A. This programs the memoryintegrated circuit 752A of the memory module to be assigned to a firstmemory sub-channel 250A, sub-channel 0.

Memory integrated circuit 752B has its identity value set to one. Theidentity input pin S0, coupled into the memory integrated circuit 752B,is set to logical one through the jumper wires 1002B and 1002A couplingto power (VCC) 1001. The identity input pin S1 of memory integratedcircuit 752B is set to zero by being coupled to ground (VSS) 1000through the jumper wires 1004B and 1006. This programs the memoryintegrated circuit 752B of the memory module to be assigned to a secondmemory sub-channel 250B, sub-channel 1.

Memory integrated circuit 752C has its identity value set to two. Thatis, the memory integrated circuit 752C is assigned to sub-channel two offour sub-channels by having its identity input pin S1 set to one and itsidentity input pin S0 set to zero. The identity input pin S1 of memoryintegrated circuit 752C is set to one by jumper wires 1004C, 1007B, and1008B coupling to power (VCC) 1001. The identity input in S0 of memoryintegrated circuit 752C is set to zero by being coupled to ground (VSS)1000 through the jumper wire 1002C′ which may include one or more viasto cross under or over jumper wire 1004C. This programs the memoryintegrated circuit 752C of the memory module to be assigned to a thirdmemory sub-channel 250C, sub-channel 2.

Memory integrated circuit 752D has its identity value set to three toindicate program it to belong to a fourth memory sub-channel,sub-channel 250D. Both S1 and S0 identity input pins of the memoryintegrated circuit 752D are set to one by being coupled to power (VCC)1001. The identity input pin S1 of integrated circuit 752D couples topower by means of jumper wires 1004D, 1007B, and 1008B. The identityinput pin S0 of the integrated circuit 752D couples to power through thejumper wires 1002D and 1008B.

FIGS. 10A-10B illustrate how jumper wires may be used to program theidentity values into the memory integrated circuits 752A-752D of amemory nodule. However, other means may be used to hardwire the logiclevels of the identity input pins S1 and S0 of the memory integratedcircuits. FIG. 10C illustrates an alternative method over that of usingjuniper wires.

Referring now to 10C, memory module 1010C is illustrated utilizing dipswitches 1020A-1020B to set the identity values onto the identity inputpins of the integrated circuits, instead of using jumper wires. Memorymodel 1010C includes memory integrated circuits 752A, 752B coupled tothe dip switch 1020A. Memory module 1010C further includes memoryintegrated circuits 752C and 752D coupled to dip switch 1020A. Each ofthe dip switches 1020A and 1020B couple to power (VCC) 1001 and ground(VSS) 1000 in order to set the identity input pins S1 and S0 to alogical one or zero for each of the memory integrated circuits752A-752D.

The dip switches 1020A-1020B couple to the identity input pins S0 and S1of each memory integrated circuit independently. For example, theidentity input pin S1 of integrated circuit 752A is coupled to andswitched independently by the dip switch 1020A from the identity inputpin S1 of integrated circuit 752B. As another example, the dip switch1020B is coupled to integrated circuit 752C independently from itscoupling to integrated circuit 752D.

Dip switch 1020A couples to the identity input pins S0 and S1 of memoryintegrated circuit 752A and the identity input pins S1 and S0 of memoryintegrated circuit 75213. Dip switch 1020B couples to the identity inputpins S1 and S0 of memory integrated circuit 752C and the identity inputpins S1 and S0 of integrated circuit 752D.

Each of the dip switches 1020A and 1020B may be a single pole doublethrow switch. The single pole couples to the respective S1 or S0 inputwhile the throws couple to power and ground. Each dip switch 1020A-1020Bincludes four single pole double throw switches, one for each identityvalue input to the memory integrated circuits.

While a pair of identity input bits and pins have described, additionalidentity bits and pins can be provided to each memory integrated circuitto enable a larger range of differing identity values. Whiledip-switches 1020A-1020B provide a switching means to set the identityinput pins and identity values, any other switch means may be used.

Referring now to FIG. 11A, with the dedicated identity input pins beinghardwired to power or ground as illustrated in FIGS. 10A-10C, theidentity input bits and the identity value can simply be received by abuffer in the memory integrated circuit. Control logic 808A includesbuffers 1120-1121 to receive the identity bit values set on the identityinput pins S0 1010 and S1 1011. The buffers 1120 and 1121 respectivelygenerate the identity bits SCS0 1110 and SCS1 1111 in response to thehardwire setting on the identity input pins S0 1010 and S1 1011. In thismanner, the register 810 is bypassed and the identity value on thededicated input pins may be used directly in the functionality of thememory integrated circuit. Note that the buffers 1120, 1121 may beinverting input buffers or non-inverting input buffers.

The micro tile enable bit may be loaded or programmed into a bit storagecircuit 850 of a register, such as the mode register 810 or an extendedmode register, of a memory integrated circuit 752 using standard, wellknown register programming techniques. For example the bit storagecircuit may be part of a register that can be accessed in a memorymapped space or an I/O mapped space on the memory integrated circuit.The bit storage circuit 850 may be a latch or a flip-flop with a datainput. The bit storage circuit 850 is then appropriately clocked orstrobed coincidentally when the micro-tile enable bit is set at its datainput to load it therein. While FIGS. 10A-10C illustrate a method ofsetting identity values by hardwire means, the identity bit values maybe logically loaded into one or more identity registers upon reset or aninitialization of the memory integrated circuits 752A-752D.

Referring now to FIG. 11B, the identity value set by the dedicatedidentity input pins being hardwired to power or ground, as isillustrated in FIGS. 10A-10C, can also be loaded into bit storagecircuits (e.g., bit registers or latches) within the memory integratedcircuits in FIG. 11B, control logic 808B includes a register 810 withbit storage circuits (e.g., bit registers or latches) 851A-851B havingtheir data inputs D coupled to the identity input pins S0 1010 and S11011 to receive the respective setting of the identity bits and identityvalue. The clock inputs of the hit storage circuits (e.g., bit registersor latches) 851A-851B are coupled to a load strobe output signal LS 1127of a load strobe generator 1122. The resent inputs of the bit storagecircuits (e.g., bit registers or latches) 851A-851B are coupled to thereset control signal 822R. The bit storage circuit 850 for themicro-tile enable bit may be loaded similarly as part of the register810 or loaded differently if part of a different register.

The load strobe generator 1122 has its input coupled to one or more ofthe control signals 822 in order to generate the load strobe outputsignal LS 1127. The load strobe generator 1122 can generate the loadstrobe output signal LS 1127 in a variety of ways in response to one ormore pulses of the one or more control signals 822. Because the identityinput pins S0 1010 and S1 1011 are hardwired and substantially fixedafter power up, the timing of one or more pulses of the one or morecontrol signals 822 can be substantially relaxed to generate the loadstrobe output signal LS 1127, FIGS. 11C-11D, discussed further below,further describe generation of load signals 1107, 1117 that may be usedas the load signal LS 1127.

Referring now to FIG. 11C, a logical means of programming individualmemory devices of the memory modules is now described. This method ofprogramming individual memory devices uses the reset signal 822R and aclock signal 822C to load identity values from data bits of the data businto the identity bit storage circuits SCS0 851A and SCS1 851B.

FIG. 11C illustrates a control logic 808C of a memory integrated circuit752 including an SCS0 bit storage circuit 851A and an SCS1 bit storagecircuit 851B as part of a mode register 810. The bit storage circuit 850for the micro-tile enable bit may be part of the mode register 810 aswell. The bit storage circuits 850,851A,851B may be D flip flops. Databit input pin D0 1000 of a data bus is coupled into the data input D ofthe D flip-flop 851A. Data bit input pin D1 1101 of a data bus iscoupled into the data input D of the D flip-flop 851B. The Q outputs ofthe D flip-flops 851A-851B are respectively coupled to the identity bits(a.k.a., sub-channel select bits) SCSO 1110 and SCS1 1111.

The control logic 808C further includes a counter 1104 to count adetermined number of clock cycles following de-assertion of the resetcontrol signal 822R from which to load the D flip-flops 851A and 851Bwith the identity bit settings off of the data bit input pins D0 1100and D1 1101 of the data bus. In one embodiment of the invention, thecounter 1104 is an eight clock cycle counter to count eight clock cyclesafter reset to generate the load signal. Coupled into the counter 1104is a clock signal 822C and a reset control signal 822R. The resetcontrol signal 822R is also coupled into the reset inputs R of the Dflip-flops 851A-851B. The output of the counter 1104 is coupled into theclock input of the D flip-flops 851A-851B such that when the counter1104 reaches a predetermined value, it generates a pulse in a loadsignal 1107 to trigger the D flip-flops 851A and 851B to load theidentity value settings. That is, a pre-determined number of clocksafter reset is de-asserted, the identity value is loaded from the databit lines of a data bus into a register of the memory integratedcircuit. After the pulse of the load signal 1107 has been generated, theclock counter 1104 continues to be clocked but rolls over and stopscounting, until the reset control signal 822R is asserted once again toreset the counter 1104. The bit storage circuit 850 for the micro-tileenable bit may be loaded similarly as part of the register 810 or loadeddifferently if part of a different register.

FIG. 13A illustrates an exemplary wave form diagram of the functionalityof the control logic 808C of FIG. 11C. A reset wave form 1300, a clockwave form 1301, a D1/D0 data bit wave form 1302A, and an SCS1/SCS0 waveform 1303A are illustrated FIG. 13A. After the reset pulse 1304 inwaveform 1300 is de-asserted, there is a predetermined number of clockcycles 1305 in waveform 1301 that occur before the setting on data bitinput pins D0/D1 of the data bus are loaded into a register to store theidentity value. During the last clock cycle 1308 of the clock signal822C, the identity bit settings on the data bit input pins D1 and D0 areready to be loaded into the integrated circuit at point 1307 on the waveform 1302A.

At point 1301A on the clock wave form 1301, the identity bit settings onthe data bit input pins D1 and D0 may be loaded into the bit storagecircuits, in response to the rising edge 1306 of a clock count signalCCNT 1107 illustrated by wave form 1303. The clock count signal CCNT1107 may also be referred to as a load signal 1107 as it loads theidentity bits into a bit storage circuit in the memory integratedcircuit. Assuming the bit storage circuits are negative edge triggered Dflip-flops, the output Q of the D flip-flop changes state on the fallingedge of the clock count signal CCNT 1107, during the last clock cycle1308 of the counter 1104, prior to the counter rolling over. Dependingupon the identity bit settings, the Q outputs of the D flip-flops maychange state from its reset state as illustrated at point 1309 on thewave form 1304A to store the identity bit values.

In this example, eight clock cycles after the reset pulse 1314 isde-asserted, the identity value for each memory device is loaded fromits D0 and D1 data input pins coupled to bits of a data bus. Becauseeach memory device has a separate set of data input pins to couple tobits of a data bus, the identity value of each memory device can beloaded with an arbitrary value that may be unique from all others. Asillustrated in FIGS. 12A-12B, the memory integrated circuits may bealigned with bytes of the width of a memory channel.

A memory controller drives the desired identity value setting for eachmemory integrated circuit onto the data bits of each byte data fieldaligned with the memory integrated circuits. The memory controllerdrives the desired identity value settings onto the data bits in eachbyte of the 64-bit data field prior the clock count CCNT value reachinga predetermined number of clock cycles after reset. In one embodiment ofthe invention, eight clock cycles after reset, the identity bit valuesare latched into an identity value field of some a register in eachmemory integrated circuit device.

Referring now to FIG. 12A, a memory module 1210A is illustratedincluding eight memory integrated circuit devices 752A-752H (Mem A-MemDev H) coupled to an edge connector 754. Each of the memory integratedcircuits 752A-752H has a number of data input/output pins that couple tothe data bits and data bus of the memory module and memory channel. Thatis, the memory integrated circuits 752A-752H are 8 bits wide (a.k.a., by8 or X8) having 8 data pins that couple to eight different data bits ofthe 64 bit data bus 1200 at the edge connector 754. Integrated circuits752A-752H respectively couple to the eight bit data bytes 1202A-1202H inFIG. 12A. Data bits on input/output pins D0 and D1 of each memoryintegrated circuit are respectively illustrated coupling between theedge connector 754 and the memory integrated circuits 752A-752H. Databit input/output pins D0 are labeled 1101A-1100H for each respectiveeight bits of data 1202A-1202H. Data bit input/output pins D11101A-1100H are respectively illustrated coupling to the eight bit databytes 1202A-1202H of the 64 bit data bus 1200.

With each memory integrated circuit 752A-752H coupling to respective D0and D1 bits 1100 and 1101, the identity value may be loaded off of thedata bus when the clock counter 1104 reaches its predetermined clockcycle count following reset.

Referring now to FIG. 12B, a memory module 1210B is illustratedincluding four memory integrated circuit devices 752A′-752D′ (Mem DevA-Mem Dev H) coupled to the edge connector 754. The four memoryintegrated circuit devices 752A′-752D′ differ from the eight memoryintegrated circuit devices 752A-752H in that the memory integratedcircuit devices 752A′-752D′ are wider. The memory integrated circuitdevices 752A′-752D′ are 16 bits wide (a.k.a., by 16 or X16) having 16data pins that couple to sixteen different data bits of the 64 bit databus 1200 at the edge connector 754. The data bits into and out from eachof the memory integrated circuits 752A-752D is 16 bits wide so that onlyfour integrated circuits may be used to couple to a 64 bit data bus1200.

Memory integrated circuit 752A′ couples to the first and second 8 bitdata bytes 1202A and 1202B of the data bus 1200. Memory integratedcircuit 752′ couples the third and fourth 8 bit data bytes 1202C and1202D. Memory integrated circuit 752C′ couples to fifth and sixth 8 bitdata byes 1202E and 1202F. Memory integrated circuit 752D′ couples tothe seventh and eighth 8 bit data bytes 1202G and 1202H.

While the width of the data bus, the physical memory channel width, fromthe memory controller to the memory modules has been described as being64 bits wide, other physical bit widths may be used for the data bus.

Previously, a dock signal was used to trigger the loading of theidentity bits into the memory integrated circuit. However, other datastrobes could also be used to trigger the loading of the identity bitsinto a memory integrated circuit. For example, a logically generateddata strobe signal is an extended mode register strobe signal EMS # thatis generated when a memory integrated circuit is sent in a programmingmode to have bits of an extended mode register programmed by acombination of control signals. The extended mode register strobe signalEMS # may be used to trigger the loading of the identity bits into thememory integrated circuit.

Referring now to FIG. 11D, a block diagram of control logic 808D of amemory integrated circuit 752 is illustrated. The control logic 808D mayuse the extended mode register strobe signal EMS #, a data strobe, asthe trigger to load the identity bits into the memory integratedcircuit. EMS # is an active low signal and it is assumed that negativeedge triggered D-flop flops may be used. Thus, when EMS # is asserted,the values on the data bus may be read into bit storage circuits such aslatches or a register, such as an identity value register or sub-channelselect register. When EMS # is de-asserted, the identity bit values arestored or latched into the bit storage circuits for internal use by thememory integrated circuits and the identity bit values set on the datainput pins can then change.

The control logic 808D includes an SCS0 bit storage circuit 851A and anSCS1 bit storage circuit 851B as part of a mode register 810. The MTEbit storage circuit 850 for the micro-tile enable bit may be part of themode register 810 as well. The bit storage circuits may be latches orD-type flops to store a bit of data. Data bit input pin D0 1100 from iscoupled into the D input of the D flip-flop 851A. Data hit input pin D11101 is coupled into the D input of the D flip-flop 851D.

The control logic 808D further includes a buffer 1105 coupled into theclock inputs of the D flip-flops 851A-851B. The buffer 1105 may be aninverter buffer formed out of a single inverter or an odd series ofinverters. Alternatively, the buffer 1105 may be a non-inverting bufferwhich may simply be formed out of an even series of inverters. In anycase, the buffer 1105 receives a control signal or data strobe signal,such as the extended mode register strobe signal EMS #1182, andgenerates a load signal 1117.

The EMS # signal 1182 is coupled into the input of the buffer 1105. TheEMS # signal 1182 is an active low signal which may then be inverted byan inverting buffer 1105 into the load signal 1117 and coupled into theclock inputs of the D flip-flops 851A-851B. The load signal 1117 isutilized to load the identity bits into the D flip-flops 851A-851B fromthe data bit input pins D1/D0. The bit storage circuit 850 for themicro-tile enable bit may be loaded similarly as part of the register810 or loaded differently if part of a different register. Otherwise thecontrol logic 808D is similar to the control logic 808C illustrated inFIG. 11C and previously described.

EMS # signal 1182 may go active low and cause the generation of the loadsignal 1117 some predetermined number of clock cycles following reset,after the reset strobe 822R goes away. By knowing when the EMS # signal1182 may go active low, the identity bit values can be set onto the databit input pins D0 1100 and D1 1101 with sufficient set up and holdtimes.

Referring now to FIG. 13B, an exemplary wave form diagram is provided toillustrate the exemplary functionality of the control logic 808D of FIG.11D. A reset wave form 1300, a data strobe/load signal LS/EMS # waveform 1310, a D1/D0 data bit wave form 1302B, and an SCS1/SCS0 wave form1303B are illustrated in FIG. 13B. The reset wave form 1300 is for thereset control input 822R. The data strobe/load signal LS/EMS # wave form1310 represents the load signal 1117 or the EMS # strobe signal 1182. Anactive low wave form for EMS # or any other strobe signal may beinverted from that of the wave form 1310. The D1/D0 data bit wave form1302B illustrates the identity input bits D1/D0 1101,1100. The SCS1/SCS0wave form 1304B illustrates the values of the identity bits SCS1/SCS01111,1110 loaded into the D flip-flops 851A-851B.

After the reset pulse 1314 of the reset control signal 822R goes away, apredetermined time period 1325 may lapse before the data strobe EMS #signal 1182 is asserted. Before the predetermined time period 1325lapses, the identity bits may be set onto the data bit input pins D1/D0to provide sufficient set up time so that they can be received into thememory integrated circuit and coupled into the bit storage circuits. Theload signal 1117 loads the identity bits set onto the data input pinsD1/D0 of the memory integrated circuit into bit storage circuits851A,851B of the register 810 therein. The bit storage circuits may be Dflip-flops, latches or other type of bit storage circuit.

Assuming negative edge triggered D type flip-flops are used as the bitstorage circuits, the rising edge 1327 of the pulse 1326 of the loadsignal waveform 1310 reads the identity bit values on the respectivedata bit input pins D1 and D0 into the D flip-flops 851A-851B. The pulse1326 of the load signal waveform 1310 may have a pulse width 1335 thatis a function of a predetermined number of clock cycles or apredetermined time period. Upon the negative going edge 1328 of thepulse 1326, the load strobe signal 1117 latches the identity values intothe D flip-flops 851A-85113 and may generate the rising edge 1329 inwaveform 1304B of the SCS1/SCS0 bits 1111, 1110. In this manner the loadsignal 1117 generated by the extended mode register strobe signal EMS#1182 may load the identity values into the integrated circuit 752.

While the extended mode register strobe signal EMS # has been describedas being used to trigger the loading of the identity bits into thememory integrated circuit, other data strobe signals generated by thecontrol signals 822 may be used.

Described previously, the data bus of the memory channel couplingbetween the edge connector and the memory integrated circuit devices 752was utilized to load the identity values into the memory integratedcircuits using a data strobe signal. However with the memory integratedcircuits in a non-data access mode, such as a program mode or a setupmode, the address bit lines of the memory channel may also be used toprogram identity values into the memory integrated circuits on thememory modules. In this case, the data strobe to load the identity bitson the address bit lines into the memory integrated circuit may beprovided on the data bus or other data bus related signal lines.

Referring now to FIG. 14, an exemplary bus structure 1400 is coupledbetween a memory controller 208 and a memory module 1410. The exemplarybus structure 1400 includes a shared address & control bus 1401, a databus (DQ[63:0]) 1402, an ECC data bus (DQ[71:64]) 1403, and a data maskbus (DM[7:0]) 1404. The data (DQ) bits of the data bus 1402 aretypically used to transfer data during a memory access between thememory module 1410 and the memory controller 208. The data mask (DM)bits of the data mask bus 1404 are typically used to mask out thetransfer of an 8-bit byte of data between a memory integrated circuit752 and the memory controller 208. In the case of 4-bit and 8-bit widememory integrated circuits, the data mask (DM) bits may be coupled tochip select control signals. In the case of memory integrated circuitsthat are 16-bit wide or of greater width, more that one data mask (DM)bit may be coupled into each memory integrated circuit.

The memory module 1410 includes the memory integrated circuits 752A-752H(D0x8-D7x8) and an ECC chip 1450 (D8x8ECC) mounted to a printed circuitboard. The memory module 1410 couples to the exemplary bus structure1400 of a host motherboard through its edge connection 754 (shown in 7,10A-10C).

As discussed previously, the address bit lines of the memory channel mayalso be used to program identity values into the memory integratedcircuits on the memory modules. However, all of the address bits of theshared address & control bus 1401 may be coupled into each of the memoryintegrated circuits 752A-75211 and the FCC chip 1450 on the memorymodule. To individually program each memory integrated separately withits own identity value, a way of independently strobing each memoryintegrated circuit may be used to load its respective identity valuesthat are set onto the shared address bits of the address bus.

To individually program the memory integrated circuits with the identityvalues on the address bus, a data qualifier on or associated with thedata bus may be used to qualify the loading of a register, such as anextended mode register (EMRS), with information on the address bus.Typically with an FAIRS setting command, the bits of a given registerare programmed with the initialization data provided on the address bus1401. The EMRS programming of a certain register can be qualified by theone or more data mask bits (DM) of the data mask bus 1014 or the one ormore data bits (DQ) of the data bus 1402 that are coupled into eachmemory integrated circuit 752A-752H.

In using the data mask bits (DM) of the data mask bus 1014 as aqualifier, if a DM bit coupled to a memory integrated circuit is set toa logical 1, then a specific EMRS register of the one memory integratedcircuit may be programmed with the contents on the address bus. Theother memory integrated circuits may be masked out by their DM bitsbeing set to logical 0 so that the given identity value is loaded intoonly one memory integrated circuit or a subset grouping of memoryintegrated circuits.

Note that the data mask bits (DM) of the data mask bus 1014 aretypically hardwired from the memory controller 208 to the memoryintegrated circuits 752 of the memory module 1410. Thus, the data maskbits are not swizzled, altered in bit positions, on the memory module1410 or the host motherboard to which the memory controller 208 ismounted. Furthermore, the data mask bits DM are not mirrored on thememory module between ranks or groups of memory integrated circuits.However, some types of memory modules that support error correctioncoding may not route the data mask bits of the data mask bus to thememory integrated circuits 752. This is because performing errorcorrection coding requires that all of the data bits of the data bus areconsistently transferred on each memory access, read or write. That is,during error correction coding, the data mask DM bits are unused. Thus,some manufacturers of memory modules supporting ECC may forgo routingthe DM bits to the memory integrated circuits.

Note that the DQ data bits of the data bus 1402 as well as the ECC bitsof the ECC data bus 1403 are routed between the memory controller 208and the respective memory integrated circuits 752A-752H and the ECC chip1450. However, the DQ bits may be swizzled as well as mirrored betweenranks. For example, the DO bit from the memory controller 208 may beconnected to a D3 data bit pin on a rank0 memory integrated circuit anda D4 data bit pin on a rank1 memory integrated circuit. Thus, single DQbits may not be sufficiently reliable to be used to send a data strobesignal to independently program each memory integrated circuit. This isbecause you may not know which single data bit pin is going to bestrobed.

To overcome the swizzling and mirroring, all the DQ data bit pins into amemory integrated circuit may be coincidentally strobed together togenerate a load signal. An AND gate, for example, having an inputcoupled to each data bit pin of the memory integrated circuit can detectthe coincidental strobing (active high) of the data hit pins together. ANOR gate, for example, having an input coupled to each data bit pin ofthe memory integrated circuit can detect the coincidental strobing(active low) of the data bit pins together.

The memory controller 208 can determine the data bit widths of thememory integrated circuits 752 that are mounted onto each memory module1410. The serial presence detect (SPD) bits stored in an EPROM mountedon a memory module may be read by the memory controller to make thisdetermination. With this information, it can determine how the width ofthe data bus 1404 and its bits are coupled into each memory integratedcircuit. For example, with 8-bit wide memory integrated circuits, databits DQ[7:0] of the data bus 1404 are coupled into memory integratedcircuit 752A.

To program the EMRS bits with information off the address bus, all ofthe DQ bits connected to a certain memory integrated circuit may bedriven to logic level ‘1’ coincidentally. Continuing with the example of8-bit wide memory integrated circuits, data bits DQ[7:0] of the data bus1404 coupled into memory integrated circuit 752A are driven to a logical‘1’ to trigger the generation of a load signal to load the register withthe identity bits. When the DQ [7:0] bits are all asserted (logic high),the values on the address bus are loaded into a specific EMRS registerin memory integrated circuit 752A during an EMRS programming mode.

Memory integrated circuits often have more that one bank of memory tostore data at a given address. The banks of memory in a memoryintegrated circuit are addressed by the bank address bits, such as bitsBA[2:0] for a memory integrated circuit with eight banks. There may bean EMRS register for each bank within a memory integrated circuit. In adevice with eight banks, there may be eight EMRS registers. In EMRSprogramming mode, a given EMRS register is selected for programmingbased on the bank address provided by the bank address bits BA[2:0].EMRS register zero (EMRS0) is selected with a bank address of BA0 or‘000’. EMRS register one (EMRS1) is selected with a bank address of BA1or ‘001’ and so on and so forth. A dedicated EMRS register or a subsetof the register, a couple of bits, can be qualified (a.k.a., triggered)with the corresponding DQ bits coupled to the memory integrated circuitto store the identity bits of the identity value. That is, not all ofthe EMRS registers in a memory integrated circuit need be loaded with anidentity value so that the bank address bits may be unused when loadingidentity values. Thus, the address lines for the bank address bits, suchas bits BA[2:0] to address eight banks, may also be used to set, carry,and load identity bits into the memory integrated circuits.

A memory rank, sometimes referred to as just a “rank”, is a block orarea of data storage that is created using some or all the memory chipson a memory module. A rank is typically has a data width of 64-bits. Onmemory modules supporting error correction coding (ECC), an additionaldata width of 8-bits is added for a total data width of 72-bits for arank that includes ECC. Depending on how memory modules are designed, amemory module may have one, two, or four ranks of 64-bit wide datastorage areas (or 72-bit wide data storage areas when ECC is supported).

Multiple memory integrated circuits that are within a given rank can beprogrammed to the same identity value using a single EMRS command. Forexample consider that memory integrated circuits 752A and 752Billustrated in FIG. 14 are in the same memory rank. The registers inboth of memory integrated circuits 752A and 752B can be programmed tothe same value using a single EMRS command by qualifying all of thecorresponding DQ bits coupled to both memory integrated circuits 752Aand 752B. That is, all of the corresponding DQ bits coupled to bothmemory integrated circuits 752A and 752B are coincidentally set to alogical ‘1’ in order to generate a load signal to store the sameidentity bits on the address bus into the registers in each.

In this manner, mode registers are loaded with the identity valuesdelivered on the address lines. Address lines are common all dynamicrandom access memory integrated circuits and are typically common to alldevices in a memory channel, including memory modules, such as a dualinline memory module (DIMM).

While certain exemplary embodiments have been described and shown in theaccompanying drawings, it is to be understood that such embodiments aremerely illustrative of and not restrictive on the broad invention, andthat the embodiments of the invention not be limited to the specificconstructions and arrangements shown and described, since various othermodifications may occur to those ordinarily skilled in the art.

When implemented in software, the elements of the embodiments of theinvention are essentially the code segments to perform the necessarytasks. The program or code segments can be stored in a processorreadable medium or transmitted by a computer data signal embodied in acarrier wave over a transmission medium or communication link. The“processor readable medium” may include any medium that can store ortransfer information. Examples of the processor readable medium includean electronic circuit, a semiconductor memory device, a read only memory(ROM), a flash memory, an erasable programmable read only memory(EPROM), a floppy diskette, a CD-ROM, an optical disk, a hard disk, afiber optic medium, a radio frequency (RE) link, etc. The computer datasignal may include any signal that can propagate over a transmissionmedium such as electronic network channels, optical fibers, air,electromagnetic, RE links, etc. The code segments may be downloaded viacomputer networks such as the Internet, Intranet, etc.

1. A method comprising: setting values of at least two identity bits foreach memory integrated circuit (IC) of a plurality of memory ICs; andperforming a micro-tile memory access, according to the values of the atleast two identity bits, into at least one of the memory ICs, of theplurality of memory ICs, by allowing size of read or write memoryfetches from the memory IC to vary.
 2. The method of claim 1, whereinthe plurality of memory ICs are mounted to a printed circuit board withan electrical connector, the printed circuit board coupled to a hostprinted circuit board, and wherein the electrical connector includespower and ground connections.
 3. The method of claim 2, wherein theelectrical connector is an edge connector with a plurality of pins,wherein the power connection is a power pin, and wherein the groundconnection is a ground pin.
 4. The method of claim 2, wherein setting ofthe values of the at least two identity bits comprises independentlycoupling at least two pins, associated with the at least two identitybits, of each memory IC to the power connection or the groundconnection.
 5. The method of claim 4, wherein independent coupling atleast two pins to the power connection or the ground connection isperformed by one or more jumper wires coupled between the at least twopins and the power or ground connections.
 6. The method of claim 4,wherein independent coupling at least two pins to the power connectionor the ground connection is performed by switching one or more switchescoupled between the at least two pins and the power or groundconnections.
 7. The method of claim 4, wherein the at least two pins areat least two dedicated identity bit pins.
 8. The method of claim 2,wherein setting of the values of the at least two identity bitscomprises independently coupling at least two pins, associated with theat least two identity bits, wherein the at least two identity pinscomprises a first pin and a second pin, and wherein the first pin iscoupled to the ground connection and the second pin is coupled to thepower connection to set the values of the at least two identity bitsonto the at least two pins of the one memory integrated circuit.
 9. Themethod of claim 1, wherein setting of the values of the at least twoidentity bits comprises coupling the values of the at least two identitybits to at least two pins, wherein the at least two pins are at leasttwo data pins of a data bus, and wherein each of the plurality of memoryICs includes a register to store values of the at least two identitybits.
 10. The method of claim 9, wherein the values of the at least twoidentity bits on the at least two data pins are loaded to the registerin response to a load strobe signal coupled to the one memory IC. 11.The method of claim 9, wherein the values of the at least two identitybits on the at least two data pins are loaded to the register inresponse to a predetermined count of clock cycles following a reset evenof the one memory IC.
 12. The method of claim 1 further comprises:receiving the at least two identity bits into each memory IC as anidentity value representing a sub-channel assigned to the memory IC. 13.The method of claim 1, wherein performing micro-tile memory accesscauses retrieving data from discontiguous memory locations as a singlecache line returning the cache line having the retrieved data.
 14. Themethod of claim 1, wherein each of the memory ICs includes a countercoupled to a register and a clock signal, and wherein the counter tocount a number of cycles of the clock signal following a reset event andto generate a load signal in response to reaching a predetermined countof clock cycles.
 15. The method of claim 1, wherein each of theplurality of memory ICs includes a buffer coupled to a register and aload strobe signal, the buffer to generate a load signal in response tothe load strobe signal.
 16. The method of claim 1, wherein performingthe micro-tile memory access comprises performing independentsub-channel memory access into the at least one memory IC.
 17. A memorymodule comprising: a plurality of memory integrated circuits (ICs)including: a register to store at least two identity bits from at leasttwo pins of each memory IC of a plurality of memory ICs; and a controllogic to perform micro-tile memory access, according to the storedvalues of the at least two identity bits, into at least one of thememory IC, of the plurality of memory ICs, by allowing size of read orwrite memory fetches from the memory IC to vary.
 18. The memory moduleof claim 17 further comprises: a printed circuit board with anelectrical connector to couple to a host printed circuit board, theelectrical connector including power and ground connections, wherein theplurality of memory ICs are mounted to the printed circuit board andcoupled to the electrical connector.
 19. The memory module of claim 18,wherein the electrical connector is an edge connector with a pluralityof pins, wherein the power connection is a power pin, and the groundconnection is a ground pin.
 20. The memory module of claim 17, whereinthe register includes one or more bit storage circuits having a datainput coupled to bits of a data bus, and wherein the register to storethe at least two identity bits of the data bus in response to a loadsignal.
 21. The memory module of claim 17, wherein each of the pluralityof memory ICs further includes a counter coupled to the register and aclock signal, the counter to count a number of cycles of the clocksignal following a reset event and to generate the load signal inresponse to reaching a predetermined count of clock cycles.
 22. Thememory module of claim 17, wherein each of the memory ICs furtherincludes a buffer coupled to the register and a load strobe signal. 23.The memory module of claim 17, wherein the micro-tile memory accesscomprises independent sub-channel memory access into the at least onememory IC.
 24. The memory module of claim 17, wherein the control unitto set values of the at least two identity bits by independentlycoupling at least two pins to a power connection or a ground connection.25. The memory module of claim 24, wherein independent coupling the atleast two pins to the power connection or the ground connection isperformed by one or more jumper wires coupled between the at least twopins and the power or ground connections.
 26. The memory module of claim24, wherein coupling the at least two pins to the power connection orthe ground connection is performed by switching one or more switchescoupled between the at least two pins and the power or groundconnections.
 27. The memory module of claim 24, wherein the at least twopins are at least two dedicated identity bit pins.
 28. The memory moduleof claim 17, wherein each of the plurality of memory ICs furtherincludes a counter coupled to the register and a clock signal.
 29. Thememory module of claim 22, wherein the buffer to generate the loadsignal in response to the load strobe signal.
 30. The memory module ofclaim 17, wherein the control logic to perform micro-tile memory accessto cause retrieving of data from discontiguous memory locations as asingle cache line.
 31. An apparatus comprising: a register to store atleast two identity bits from at least two pins of a memory IntegratedCircuit (IC); and a control logic to perform micro-tile memory access,according to the stored values of the at least two identity bits, intothe memory IC by allowing size of read or write memory fetches from thememory IC to vary.
 32. The apparatus claim 31 further comprises: aprinted circuit board with an electrical connector to couple to a hostprinted circuit board, the electrical connector including power andground connections.
 33. The apparatus of claim 32, wherein the memory ICis mounted to the printed circuit board and coupled to the electricalconnector.